Near-Infrared LED Reflow Soldering for Flexible Hybrid Electronics
- Reflow soldering of printed flexible low-cost electronics continues to pose a challenge, which is hampering the growth of the technology. The specific process parameter requirements severely limit the available soldering technologies. This study focuses on the suitability of a new photonic soldering process based on individually controllable near-infrared light emitting diodes (NIR LEDs) for processing screen-printed silver (Ag) structures and etched copper (Cu) structures on polyethylene terephthalate (PET) with low-temperature solders of the Tin-Bismuth-Silver (SnBiAg) group. The approach enabled various component sizes to be successfully soldered under more favorable conditions. An analysis of the shear strength shows comparable behavior for the copper structures compared to samples that were convectively soldered. A significant improvement in the shear strength of the printed silver structures was achieved using the new NIR process.
| Author: | Thomas WengerORCiD, Jewgeni RoudenkoORCiD, Marcus ReichenbergerORCiD |
|---|---|
| DOI: | https://doi.org/10.1109/MIDCongress66428.2025.11547736 |
| Parent Title (English): | 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress) |
| Publisher: | IEEE |
| Document Type: | conference proceeding (article) |
| Language: | English |
| Reviewed: | Begutachtet/Reviewed |
| Release Date: | 2026/06/18 |
| Tag: | Flexible Electronics; Hybrid Electronics; Interconnection technology; Printed Electronics; Soldering |
| Pagenumber: | 6 |
| First Page: | 1 |
| Last Page: | 6 |
| institutes: | Institut für Chemie, Material- und Produktentwicklung |
| Research Themes: | Materialien & Produktionstechnik |
