Reflow soldering for low-cost electronics using near-infrared LEDs

  • Despite advances in soldering technology, the soldering of flexible, low-cost substrates such as polyethylene terephthalate (PET) remains a significant challenge, even when using low-temperature solders. This paper presents a novel approach to energy transfer that takes advantage of the varying absorption levels of materials in the near-infrared (NIR) spectrum to achieve selective heating of electronic assemblies. By combining the different absorption behaviours of bare PET and copper-clad PET with an irradiation concept that includes the use of NIR LEDs, it is possible to achieve a highly controlled and locally limited heating of the assemblies. An experimental soldering setup was utilised to identify the parameters that influence the process. The solder joints of the chip resistor components exhibited comparable microstructure and mechanical strength to those soldered by a convective method. The preliminary reliability tests demonstrated that the NIR soldering process produces high-quality solder joints. Further studies will addressDespite advances in soldering technology, the soldering of flexible, low-cost substrates such as polyethylene terephthalate (PET) remains a significant challenge, even when using low-temperature solders. This paper presents a novel approach to energy transfer that takes advantage of the varying absorption levels of materials in the near-infrared (NIR) spectrum to achieve selective heating of electronic assemblies. By combining the different absorption behaviours of bare PET and copper-clad PET with an irradiation concept that includes the use of NIR LEDs, it is possible to achieve a highly controlled and locally limited heating of the assemblies. An experimental soldering setup was utilised to identify the parameters that influence the process. The solder joints of the chip resistor components exhibited comparable microstructure and mechanical strength to those soldered by a convective method. The preliminary reliability tests demonstrated that the NIR soldering process produces high-quality solder joints. Further studies will address the remaining issues, such as solder beading and the soldering of more complex components and assemblies.show moreshow less

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Metadaten
Author:Thomas WengerORCiD, Philipp SchlettererORCiD, Marcus ReichenbergerORCiD
DOI:https://doi.org/10.1088/2058-8585/adb0da
ISSN:2058-8585
Parent Title (English):Flexible and Printed Electronics
Publisher:IOP Publishing
Document Type:Article
Language:English
Reviewed:Begutachtet/Reviewed
Release Date:2025/02/18
Tag:Flexible Electronics; Hybrid Electronics; Interconnection technology; Printed Electronics; Soldering
institutes:Institut für Chemie, Material- und Produktentwicklung
Research Themes:Materialien & Produktionstechnik
Licence (German):Creative Commons - CC BY - Namensnennung 4.0 International
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