Characterization of Crimp Interconnections for Hybrid Integration of Screen-Printed Electronics

  • In this work, electrical contacts between piercing-crimp terminals and screen-printed silver structures on three different polymeric films are characterized electrically and mechanically before and after accelerated thermal aging tests. Temperature cycling and constant thermal load tests were performed as like as ampacity and resistance measurements and tensile tests. The tensile tests show that the mechanical strength of the crimp connection depends on substrate material, but is independent of the aging state. For all joints, breaking forces of more than 100 N were achieved. Furthermore, some of tested connections can be loaded with more than 2.5 A in unaged state till they heat up by 25 K. Besides that, accelerated thermal aging generally leads to a reduction in electrical resistance in our experiments.

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Author:Michael HümmerORCiD, Julian Schirmer, Matthias Klauss, Marcus Reichenberger
DOI:https://doi.org/10.1109/isse51996.2021.9467558
Parent Title (English):2021 44th International Spring Seminar on Electronics Technology (ISSE)
Publisher:IEEE
Document Type:conference proceeding (article)
Language:English
Date of first Publication:2021/07/01
Reviewed:Begutachtet/Reviewed
Release Date:2024/08/01
Pagenumber:7
institutes:Fakultät für Elektrotechnik Feinwerktechnik Informationstechnik
Institut für Chemie, Material- und Produktentwicklung
Research Themes:Materialien & Produktionstechnik
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