TY - JOUR A1 - Wendel, Sebastian A1 - Karamanakos, Petros A1 - Gebhardt, Philipp A1 - Dietz, Armin A1 - Kennel, Ralph T1 - Flux Linkage-Based Direct Model Predictive Current Control for Synchronous Machines JF - IEEE Transactions on Power Electronics N2 - This article presents a flux linkage-based direct model predictive current control approach that achieves favorable performance both during steady-state and transient operation. The former is achieved by computing the optimal time instants at which a new switch position is applied to the converter. To this end, the future current behavior is not computed based on the machine inductances or inductance look-up tables; instead, flux linkage maps are utilized to predict the trajectory of the magnetic flux linkage, and subsequently of the current. This is advantageous for electric drives with noticeable magnetic nonlinearity in terms of saturation and/or cross-coupling effects. Hence, by using flux linkage maps in the prediction process, the evolution of the stator current can be calculated more accurately, enabling the controller to make better switching decisions. Moreover, the discussed predictive controller exhibits excellent dynamic performance owing to its direct control nature, i.e., the control and modulation tasks are performed in one computational stage rendering a dedicated modulation stage redundant. Three different drive systems based on permanent magnet synchronous motors are examined to demonstrate the effectiveness of the presented control approach. Y1 - 2021 U6 - https://doi.org/10.1109/tpel.2021.3083657 SN - 0885-8993 VL - 36 IS - 12 SP - 14237 EP - 14256 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - JOUR A1 - Dietz, Armin A1 - Di Tommaso, Antonino Oscar A1 - Marignetti, Fabrizio A1 - Miceli, Rosario A1 - Nevoloso, Claudio T1 - Enhanced Flexible Algorithm for the Optimization of Slot Filling Factors in Electrical Machines JF - Energies N2 - The continuous development in the field of industrial automation and electric mobility has led to the need for more efficient electrical machines with a high power density. The improvement of electrical machines’ slot filling factors is one of the measures to satisfy these requirements. In recent years, this topic has aroused greater interest in the industrial sector, since the evolution of the winding technological manufacturing processes allows an economically sustainable realization of ordered winding arrangements, rather than random ones. Moreover, the manufacture of electrical machines’ windings must be preceded by an accurate design phase in which it is possible to evaluate the maximum slot filling factor obtainable for a given wire shape and for its dimensions. For this purpose, this paper presents an algorithmic approach for the evaluation of maximum slot filling factors in electrical machines under an ideal geometric premise. In particular, this algorithm has a greater degree of flexibility with respect to the algorithm approaches found in the literature, since the study has been extended to round, rectangular and hexagonal wire sections. Furthermore, the slot filling factor calculation was carried out both for standard and non-standard slots. The algorithmic approach proposed can be considered as an additional useful tool for the fast design of electrical machine windings. KW - electrical motors; sot filling factor; optimization algorithm; windings; magnetic wire; filling factor optimization Y1 - 2020 U6 - https://doi.org/10.3390/en13051041 SN - 1996-1073 VL - 13 IS - 5 PB - MDPI AG ER - TY - CHAP A1 - Hümmer, Michael A1 - Schirmer, Julian A1 - Klauss, Matthias A1 - Reichenberger, Marcus T1 - Characterization of Crimp Interconnections for Hybrid Integration of Screen-Printed Electronics T2 - 2021 44th International Spring Seminar on Electronics Technology (ISSE) N2 - In this work, electrical contacts between piercing-crimp terminals and screen-printed silver structures on three different polymeric films are characterized electrically and mechanically before and after accelerated thermal aging tests. Temperature cycling and constant thermal load tests were performed as like as ampacity and resistance measurements and tensile tests. The tensile tests show that the mechanical strength of the crimp connection depends on substrate material, but is independent of the aging state. For all joints, breaking forces of more than 100 N were achieved. Furthermore, some of tested connections can be loaded with more than 2.5 A in unaged state till they heat up by 25 K. Besides that, accelerated thermal aging generally leads to a reduction in electrical resistance in our experiments. Y1 - 2021 U6 - https://doi.org/10.1109/isse51996.2021.9467558 PB - IEEE ER - TY - JOUR A1 - Schirmer, Julian A1 - Hümmer, Michael A1 - Klauß, Matthias A1 - Neermann, Simone A1 - Reichenberger, Marcus A1 - Franke, Jörg T1 - Evaluation of detatchable board-to-board interconnects on screen printed electronic structures JF - Flexible and Printed Electronics N2 - Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results. Y1 - 2021 U6 - https://doi.org/10.1088/2058-8585/ac1fd5 SN - 2058-8585 VL - 6 IS - 3 PB - IOP Publishing ER - TY - CHAP A1 - Schirmer, Julian A1 - Reichenberger, Marcus A1 - Neermann, Simone A1 - Franke, Jorg T1 - Conformable Electronics: Thermoforming and Injection Molding of Electronic Components N2 - In this paper the stress on electronic components for Conformable Electronic applications is evaluated. During High-Pressure-Forming (HPF) and subsequent overmolding (OM) these components have to withstand high amounts of stress. Globtops are used to protect 0402 as well as 0603-sized components mounted on different polymer substrates. The components are placed in different areas of deformation (for HPF) and melt velocities (for OM). The components are afterwards examined by means of electrical resistance measurements and shear force measurements as well as micro-sections. For conductive adhesive, the globtop material positively influenced the resistance change after deformation, soldered assemblies showcased good formability up to 20 %. The shear force drop caused by higher deformations could be mitigated using globtop materials. Soldered components were able to withstand OM when globtops were used. Here, smaller components seem to take less damage from the impacting melt. Components should be placed in areas where the melt has cooled down to prevent damages. Y1 - 2021 U6 - https://doi.org/10.1109/isse51996.2021.9467588 PB - IEEE ER - TY - CHAP A1 - Schirmer, Julian A1 - Reichenberger, Marcus A1 - Wimmer, Annette A1 - Reichel, Herbert A1 - Neermann, Simone A1 - Franke, Jorg T1 - Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics N2 - The integration of SMT components is necessary to produce more complex assemblies within the framework of conformable electronics. During High-Pressure-Forming (HPF) and subsequent overmolding electronic components must withstand high amounts of stress. In this study 0402- as well as 0603-sized chip resistors were mounted on different common polymer substrates using conductive adhesive paste followed by electrical and mechanical evaluation. Prior to HPF electronic components were positioned in areas of different local deformation. After HPF the specimen were characterized by shear force testing and electrical resistance measurements. In a similar manner, electronic components were tested to assess the mechanical behavior during injection molding. To examine different melt induced stress scenarios, electronic components were arranged parallel as well as perpendicular to the flow direction of the melt at different positions. Additionally, three different injection speeds were evaluated to assess the influence on the electrical conductivity and functionality of the assemblies. It was found that meandering of conductors is necessary for higher deformations. El. components (without additional nonconductive adhesives) can be placed in areas of up to 15% deformation, smaller package sizes seem to be advantageous for HPF. Regarding overmoulding, it was found that larger components (larger bonding area) is beneficial. Also, placement near the injection point, as well as low injection speeds should be avoided. Overall, el. components should be protected (using globtops / underfills etc.) to withstand consecutive HPF and overmoulding. Y1 - 2021 U6 - https://doi.org/10.1109/mid50463.2021.9361624 PB - IEEE ER - TY - CHAP A1 - Roudenko, Jewgeni A1 - Neermann, Simone A1 - Schirmer, Julian A1 - Reichenberger, Marcus A1 - Franke, Jorg T1 - Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- and UVradiation N2 - In the research project AVerdi the influence of photonic sintering methods on the resulting electrical conductivity, sintering duration and adhesion of digitally printed silver nanoparticle inks was investigated and compared to convective sintering. Conductor paths with film thicknesses below 1 μm were applied on flexible polymer substrates via inkjet printing. Aerosoljet printing was used to generate thicker lines up to 11 μm on injection molded substrates. Photonic sintering was carried out with near infrared emitters or ultraviolet light emitting diodes. For inkjet printed structures on polyimide a conductivity up to 24 % relative to bulk silver was achieved after a sintering duration of 2 s and 5 s for the near infrared and the ultraviolet light source, respectively. Oven sintered samples showed an electrical conductivity of 14 % after 1 h at 200° C. On polyethylene terephthalate a conductivity around 7 % was achieved after irradiation with near infrared light for 1 s, whereas convectively sintered samples showed a conductivity around 4 %. All material combinations sintered by the different methods showed good adhesion. The overall results of long-term behavior after thermal-cycling, regarding electrical conductivity and adhesion, show that the photonically sintered structures achieve similar results compared to the reference. The photonically sintered structures generated with the aerosoljet on polyamide 6 achieved conductivity values up to 19 %, which were comparable to the furnace sintered reference samples. On liquid crystal polymer substrates conductivity values reached up to 35 % after sintering with ultraviolet light emitting diodes for 60 s. Oven sintered samples showed a conductivity around 25 % after 1 h at 150° C. The adhesion of the silver nanoparticle ink on liquid crystal polymer and polyamide 6 substrates is better than with the reference samples. The reliability tests show fewer failures with alternative sintered samples. In this study only the results for inkjet printed structures are presented. Y1 - 2021 U6 - https://doi.org/10.1109/mid50463.2021.9361627 PB - IEEE ER - TY - CHAP A1 - Bergner, Christian A1 - Akan, Ferhat A1 - Schmidt-Vollus, Ronald A1 - Heß, Peter A1 - Deuerlein, Christian T1 - Portable Safety System using Radar for Flexible Human-Robot-Collaboration in a Real Semi-automated Production Line T2 - Proceedings of the 2nd International Conference on Robotics, Computer Vision and Intelligent Systems ROBOVIS - Volume 1 N2 - The implementation of a reliable vision system for a human-robot environment is a key issue for the collaborative production industry. The core challenge of human-robot collaboration is to ensure safety. Furthermore, a flexible safety system is required for frequently changing applications and work areas. This paper focuses on the development and application of a workspace monitoring system for safeguarding using radar sensors. The human-robot collaboration cell is designed to enable a flexible integration regardless of the work location. This results in higher productivity. Since no separating protective devices are provided for the cell, safety-oriented monitoring and control by suitable safety sensors is required. The methods to minimize the size of the necessary safety distance will be presented. The experimental validation shows that this safety system with radar sensors performs a reliable workspace monitoring system. The high robustness, reactivity and flexibility of the safet y concept makes this system usable for collaborative tasks in a real industrial environment. KW - Human-Robot-Collaboration, Safety System, Radar, Flexibility, Portability, Standard-CE. Y1 - 2021 SN - 978-989-758-537-1 U6 - https://doi.org/10.5220/0010645800003061 SP - 67 EP - 76 PB - SCITEPRESS - Science and Technology Publications ER - TY - JOUR A1 - Kofer, Daniel A1 - Bergner, Christian A1 - Deuerlein, Christian A1 - Schmidt-Vollus, Ronald A1 - Heß, Peter T1 - Human–robot-collaboration: Innovative processes, from research to series standard JF - Procedia CIRP N2 - Sensitive robots are an innovative technology of tomorrow ´s production. The Human–Robot-Collaboration (HRC) with its variable combination of unique skills represents a future-oriented form of work. Yet, there is a lack of experience in process realization, safety requirements are often not given and economic efficiency is still missing. There are a lot of innovative process solutions in research but industrial conditions are less considered. In this work, the approaches for the realization of standardizable HRCs for assembly operations in the automotive sector will be outlined. The aim is to present simple ways from the idea to series production by considering permitted limits. Based on an industrial application, innovative collaborations are realized with only few hardware and software components. In this context, standard compliant safety is ensured through internal system features and adjusted component designs. Additionally, an approach for HRC safety through real-time monitoring of the endeffector area is presented. As an outlook there is a guideline for HRC realization. KW - Human–robot-collaboration Hybrid assembly Safe operation Ergonomics Y1 - 2021 U6 - https://doi.org/10.1016/j.procir.2020.09.185 SN - 2212-8271 VL - 97 SP - 98 EP - 103 PB - Elsevier BV ER - TY - CHAP A1 - Müller, Andreas W. A1 - Kerber, Florian A1 - Legat, Christoph ED - Seebacher, Uwe ED - Legat, Christoph T1 - Resilience-X: Towards Resilient Manufacturing Companies An In-depth Analysis of Requirements and Challenges T2 - Collective Intelligence N2 - In an age characterized by unprecedented global uncertainties and disruptions, the resilience of the manufacturing industry stands as an imperative of utmost significance. The contemporary manufacturing landscape is an intricate web of interconnected processes, technologies, and supply chains that, when subjected to unforeseen challenges, can be vulnerable to disruptions with far-reaching consequences. The capacity of manufacturing enterprises to adapt, recover, and thrive in the face of adversity has become a defining factor in their long-term sustainability and competitiveness.[...] KW - Resilience KW - Knowledge Engineering KW - Knowledge Modeling KW - Domain Modeling KW - Manufacturing Industry Y1 - 2024 SN - 9781032690711 U6 - https://doi.org/10.1201/9781032690711-4 SP - 82 EP - 105 PB - CRC Press CY - Boca Raton ER -