<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>3169</id>
    <completedYear>2025</completedYear>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>article</type>
    <publisherName>IOP Publishing</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Reflow soldering for low-cost electronics using near-infrared LEDs</title>
    <abstract language="eng">Despite advances in soldering technology, the soldering of flexible, low-cost substrates such as polyethylene terephthalate (PET) remains a significant challenge, even when using low-temperature solders. This paper presents a novel approach to energy transfer that takes advantage of the varying absorption levels of materials in the near-infrared (NIR) spectrum to achieve selective heating of electronic assemblies. By combining the different absorption behaviours of bare PET and copper-clad PET with an irradiation concept that includes the use of NIR LEDs, it is possible to achieve a highly controlled and locally limited heating of the assemblies. An experimental soldering setup was utilised to identify the parameters that influence the process. The solder joints of the chip resistor components exhibited comparable microstructure and mechanical strength to those soldered by a convective method. The preliminary reliability tests demonstrated that the NIR soldering process produces high-quality solder joints. Further studies will address the remaining issues, such as solder beading and the soldering of more complex components and assemblies.</abstract>
    <parentTitle language="eng">Flexible and Printed Electronics</parentTitle>
    <identifier type="issn">2058-8585</identifier>
    <identifier type="doi">10.1088/2058-8585/adb0da</identifier>
    <enrichment key="opus_doi_flag">true</enrichment>
    <enrichment key="opus_import_data">{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,1]],"date-time":"2025-02-01T05:30:28Z","timestamp":1738387828014,"version":"3.35.0"},"reference-count":0,"publisher":"IOP Publishing","license":[{"start":{"date-parts":[[2025,1,31]],"date-time":"2025-01-31T00:00:00Z","timestamp":1738281600000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2025,1,31]],"date-time":"2025-01-31T00:00:00Z","timestamp":1738281600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/iopscience.iop.org\/info\/page\/text-and-data-mining"}],"funder":[{"name":"Central Innovation Programme for small and medium-sized enterprises","award":["16KN098741"]},{"DOI":"10.13039\/100021130","name":"Bundesministerium f\u00fcr Wirtschaft und Klimaschutz","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100021130","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Flex. Print. Electron."],"abstract":"&lt;jats:title&gt;Abstract&lt;\/jats:title&gt;\n               &lt;jats:p&gt;Despite advances in soldering technology, the soldering of flexible, low-cost substrates such as polyethylene terephthalate (PET) remains a significant challenge, even when using low-temperature solders. This paper presents a novel approach to energy transfer that takes advantage of the varying absorption levels of materials in the near-infrared (NIR) spectrum to achieve selective heating of electronic assemblies. By combining the different absorption behaviours of bare PET and copper-clad PET with an irradiation concept that includes the use of NIR LEDs, it is possible to achieve a highly controlled and locally limited heating of the assemblies. An experimental soldering setup was utilised to identify the parameters that influence the process. The solder joints of the chip resistor components exhibited comparable microstructure and mechanical strength to those soldered by a convective method. The preliminary reliability tests demonstrated that the NIR soldering process produces high-quality solder joints. Further studies will address the remaining issues, such as solder beading and the soldering of more complex components and assemblies.&lt;\/jats:p&gt;","DOI":"10.1088\/2058-8585\/adb0da","type":"journal-article","created":{"date-parts":[[2025,1,31]],"date-time":"2025-01-31T22:49:28Z","timestamp":1738363768000},"source":"Crossref","is-referenced-by-count":0,"title":["Reflow soldering for low-cost electronics using near-infrared LEDs"],"prefix":"10.1088","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-1565-9420","authenticated-orcid":false,"given":"Thomas","family":"Wenger","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0009-0004-6859-7840","authenticated-orcid":false,"given":"Philipp","family":"Schletterer","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0009-0007-3537-2786","authenticated-orcid":false,"given":"Marcus","family":"Reichenberger","sequence":"additional","affiliation":[]}],"member":"266","published-online":{"date-parts":[[2025,1,31]]},"container-title":["Flexible and Printed Electronics"],"original-title":[],"link":[{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/2058-8585\/adb0da","content-type":"text\/html","content-version":"am","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/2058-8585\/adb0da\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/2058-8585\/adb0da\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/2058-8585\/adb0da\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,31]],"date-time":"2025-01-31T22:49:30Z","timestamp":1738363770000},"score":1,"resource":{"primary":{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/2058-8585\/adb0da"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,31]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1088\/2058-8585\/adb0da","relation":{},"ISSN":["2058-8585"],"issn-type":[{"value":"2058-8585","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1,31]]}}}</enrichment>
    <enrichment key="local_crossrefDocumentType">journal-article</enrichment>
    <enrichment key="local_crossrefLicence">https://creativecommons.org/licenses/by/4.0/</enrichment>
    <enrichment key="local_import_origin">crossref</enrichment>
    <enrichment key="local_doiImportPopulated">PersonAuthorFirstName_1,PersonAuthorLastName_1,PersonAuthorIdentifierOrcid_1,PersonAuthorFirstName_2,PersonAuthorLastName_2,PersonAuthorIdentifierOrcid_2,PersonAuthorFirstName_3,PersonAuthorLastName_3,PersonAuthorIdentifierOrcid_3,PublisherName,TitleMain_1,TitleAbstract_1,TitleParent_1,CompletedYear,IdentifierIssn,Enrichmentlocal_crossrefLicence</enrichment>
    <enrichment key="Reviewstatus">Begutachtet/Reviewed</enrichment>
    <enrichment key="opus.source">doi-import</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">false</enrichment>
    <licence>Creative Commons - CC BY - Namensnennung 4.0 International</licence>
    <author>Thomas Wenger</author>
    <author>Philipp Schletterer</author>
    <author>Marcus Reichenberger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Interconnection technology</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Soldering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Flexible Electronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Printed Electronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Hybrid Electronics</value>
    </subject>
    <collection role="institutes" number="">Institut für Chemie, Material- und Produktentwicklung</collection>
    <collection role="Forschungsschwerpunkt" number="2">Materialien &amp; Produktionstechnik</collection>
  </doc>
  <doc>
    <id>4682</id>
    <completedYear>2026</completedYear>
    <publishedYear>2026</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>1-12</pageFirst>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>DVS Media GmbH</publisherName>
    <publisherPlace>Düsseldorf</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>0206-02-25</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Reflowlöten auf Aluminiumleiterstrukturen – ZIM-Projekt ALUSolder</title>
    <abstract language="deu">Im ZIM-Kooperationsprojekt „ALUSolder“, gefördert durch das Bundesministerium für Wirtschaft und Klimaschutz im Rahmen des IraSME-Netzwerks mit Partnern aus Deutschland und Österreich, wird der Ersatz von Kupfer durch Aluminium entlang der gesamten Prozesskette der Leiterplattenfertigung untersucht. Der Projektansatz basiert auf der selektiven Beschichtung der Anschlussflächen aus Aluminium mit einer chemisch aufgebrachten Nickel-Phosphor-Schicht. Dieses Metallisierungs-verfahren ist mit den für starre Leiterplatten verwendeten Kunststoffen und Kompositmaterialien kompatibel und ermöglicht lötfähige Oberflächen für den anschließenden einseitigen Reflowlötprozess bei einlagigen Leiterplatten. Im weiteren Verlauf wird untersucht, welche Leiterbahnstrukturen mit der eingesetzten Aluminiumlegierung zuverlässig realisiert werden können. Zudem wird die Haftfestigkeit zwischen Leiterbahn und Epoxidverbundsystem im Vergleich zu herkömmlichen Kupferleiterbahnen analysiert. Zur Bewertung der Zuverlässigkeit und Lebensdauer werden verschiedene Umwelt-simulationstests durchgeführt. Anschließend werden die gealterten Lötverbindungen umfassend hinsichtlich ihrer mechanischen und elektrischen Eigenschaften charakterisiert und den Lötverbindungen konventioneller Kupferleiterplatten gegenübergestellt. Ziel des Projekts ist es, die technologischen Grundlagen für den industriellen Einsatz von Aluminiumleiterstrukturen zu schaffen und somit einen Beitrag zur Elektronikproduktion der Zukunft zu leisten.</abstract>
    <parentTitle language="deu">E-Book Elektronische Baugruppen und Leiterplatten EBL 2026</parentTitle>
    <identifier type="isbn">978-3-96144-320-8</identifier>
    <identifier type="doi">10.53192/EBL20260001</identifier>
    <enrichment key="ConferenceStatement">EBL 2026</enrichment>
    <enrichment key="Reviewstatus">Begutachtet/Reviewed</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="OtherSeries">DVS Berichte ; 404</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">false</enrichment>
    <licence>Keine Lizenz - Deutsches Urheberrecht gilt</licence>
    <author>Philipp Schletterer</author>
    <author>Wenger Thomas</author>
    <author>Marcus Reichenberger</author>
    <author>Michael Bisges</author>
    <author>Martin Muckelbauer</author>
    <author>Markus Schiffmann</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Aufbau- und Verbindungstechnik</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Elektronikproduktion</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Elektronische Baugruppen</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Leiterplatten</value>
    </subject>
    <collection role="institutes" number="">Institut für Chemie, Material- und Produktentwicklung</collection>
    <collection role="Forschungsschwerpunkt" number="2">Materialien &amp; Produktionstechnik</collection>
  </doc>
</export-example>
