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PCB embedding in combination with direct-bonded copper (DBC) substrates is an attractive approach for packaging of power semiconductors facilitating low-inductive designs while relying on a proven insulating material. However, the CTE mismatch of these materials could cause reliability issues. This study presents an initial reliability screening using simple IGBT prepackages with alumina-based DBC as test vehicles. After -40/150 °C temperature cycles, fracture of the substrate and the chip is observed, resulting in an increased on-state resistance. Literature data suggest that the substrate failure is independent from the embedding. To gain a deeper understanding of the limitations of the technology, further research with optimized DBC substrates is required.
Kempten hat sich zu einer Drehscheibe für angehende Automobilingenieure entwickelt. Der ADAS-Master der Universität ist der weltweit einzige seiner Art. Sechs Studenten erzählen uns, warum sie vom automatisierten Fahren fasziniert sind, was sie von zukünftigen Arbeitgebern erwarten und wie sich der „Fahrspaß“ mit autonomen Autos verändern wird.