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Top side isolation investigation of PCB embedded 1.2kV dies

  • The embedding of power electronics components into the PCB increases their thermal and electrical performance. Due to lower parasitic inductances and a lower thermal resistance, the overall power density of the system can be increased. However, there is a lack on studies about the reliability of PCB embedded power electronics, especially under humidity stress. This study uses test vehicles with functional diodes embedded into the PCB. The reliability of the test vehicles is studied under HV-H3TRB conditions. A critical leakage current is observed after 200h with a benzoxazine based prepreg and after 600h for an epoxy based prepreg. A rootcause analysis revealed lift-off of the polyimide layer and subsequent electrochemical corrosion as failure mechanism. The delamination is most likely triggered by the Au surface on the chips top metal pad. A second set of test samples was fabricated using an improved surface treatment before lamination. 75% of these samples passed the 1000h H3TRB test successfully.

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Metadaten
Author:Luca Link, Ankit Bhushan Sharma, Vladimir Polezhaev, Till HuesgenORCiD, Michael Vaas, Günther Stohrer, Frank Koch
DOI:https://doi.org/10.23919/EMPC53418.2021.9584979
Identifier:978-0-9568086-7-7 OPAC HS OPAC extern
Identifier:978-1-6654-2368-7 OPAC HS OPAC extern
Parent Title (English):2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher:IEEE
Document Type:conference proceeding (article)
Conference:23rd European Microelectronics and Packaging Conference, 13-16 Sept. 2021, Gothenburg, Sweden and Online
Language:English
Year of first Publication:2021
Tag:MEDAL
Number of pages:7 Seiten
First Page:1
Last Page:7
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Polezhaev, Vladimir
Research Project:MEDAL – Modulares Leiterplatten-Embedding für Anwendungen der Leistungselektronik
Publication reviewed:begutachtet
Release Date:2021/12/09
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