• search hit 2 of 2
Back to Result List

Reliability Screening of a Hybrid DBC/PCB power semiconductor prepackage

  • PCB embedding in combination with direct-bonded copper (DBC) substrates is an attractive approach for packaging of power semiconductors facilitating low-inductive designs while relying on a proven insulating material. However, the CTE mismatch of these materials could cause reliability issues. This study presents an initial reliability screening using simple IGBT prepackages with alumina-based DBC as test vehicles. After -40/150 °C temperature cycles, fracture of the substrate and the chip is observed, resulting in an increased on-state resistance. Literature data suggest that the substrate failure is independent from the embedding. To gain a deeper understanding of the limitations of the technology, further research with optimized DBC substrates is required.

Export metadata

Additional Services

Search Google Scholar
Metadaten
Author:Till HuesgenORCiD, Vladimir Polezhaev, Ankit Bhushan Sharma, Chunlei Liu, Mohammadhossein Montazerian, Patrick Stadler, Niko Pavliček, Giovanni Salvatore
DOI:https://doi.org/10.23919/EMPC53418.2021.9584983
Identifier:978-0-9568086-7-7 OPAC HS OPAC extern
Identifier:978-1-6654-2368-7 OPAC HS OPAC extern
Parent Title (English):2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher:IEEE
Document Type:conference proceeding (article)
Conference:23rd European Microelectronics and Packaging Conference, 13-16 Sept. 2021, Gothenburg, Sweden and Online
Language:English
Year of first Publication:2021
Tag:empsABB
Number of pages:5 Seiten
First Page:1
Last Page:5
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Polezhaev, Vladimir
Publication reviewed:begutachtet
Release Date:2021/12/09
Verstanden ✔
Diese Webseite verwendet technisch erforderliche Session-Cookies. Durch die weitere Nutzung der Webseite stimmen Sie diesem zu. Unsere Datenschutzerklärung finden Sie hier.