MetadatenAuthor: | Till HuesgenORCiD, Vladimir Polezhaev, Ankit Bhushan Sharma, Chunlei Liu, Mohammadhossein Montazerian, Patrick Stadler, Niko Pavliček, Giovanni Salvatore |
---|
DOI: | https://doi.org/10.23919/EMPC53418.2021.9584983 |
---|
Identifier: | 978-0-9568086-7-7 OPAC HS OPAC extern |
---|
Identifier: | 978-1-6654-2368-7 OPAC HS OPAC extern |
---|
Parent Title (English): | 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) |
---|
Publisher: | IEEE |
---|
Document Type: | conference proceeding (article) |
---|
Conference: | 23rd European Microelectronics and Packaging Conference, 13-16 Sept. 2021, Gothenburg, Sweden and Online |
---|
Language: | English |
---|
Year of first Publication: | 2021 |
---|
Tag: | empsABB |
---|
Number of pages: | 5 Seiten |
---|
First Page: | 1 |
---|
Last Page: | 5 |
---|
Institutes: | Fakultät Elektrotechnik |
---|
Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften |
---|
Research focus: | FSP1: Energie |
---|
| FSP3: Produktion |
---|
Publication Lists: | Huesgen, Till |
---|
| Sharma, Ankit Bhushan |
---|
| Polezhaev, Vladimir |
---|
Publication reviewed: | begutachtet |
---|
Release Date: | 2021/12/09 |
---|