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Horizontal Cracks in PCB Embedded Semiconductor Devices: A Real Problem or a Ghost Hunt?

  • Horizontal chip cracks have been reported in various scientific publications on PCB embedded power semiconductor devices. This study investigates in detail the root cause of the cracks. Experimental evidence indicates that the chip fractures in the mechanical grinding process during preparation of the cross-sections. Here, two different factors are relevant: First, the mechanical fracture strength of the semiconductor die decreases when grinding its edge. The use of P320 sand paper reduces the characteristic fracture strength from 719 MPa to 211 MPa. Second, the tensile stresses in the chip edge increase considerably when, part of the die and package is removed by grinding. Both effects together result in a failure probability of 100%. The use of finer grain sandpaper for target preparation helps to reduce the probability of generating horizontal chip cracks during cross-sectioning.

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Metadaten
Author:Till HuesgenORCiD, Ankit Bhushan Sharma
URL / DOI:https://ieeexplore.ieee.org/document/10564770
Identifier:978-3-8007-6288-0 OPAC HS OPAC extern
Parent Title (English):CIPS 2024 : 13th International Conference on Integrated Power Electronics Systems
Publisher:VDE
Place of publication:Berlin
Document Type:conference proceeding (article)
Conference:CIPS 2024; 13th International Conference on Integrated Power Electronics Systems, 12. - 14. März 2024, Düsseldorf, Germany
Language:English
Date of Publication (online):2024/06/19
Year of first Publication:2024
Tag:MEDAL
Article Number:10564770
Number of pages:6 Seiten
First Page:490
Last Page:495
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 60 Technik
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Research Project:MEDAL – Modulares Leiterplatten-Embedding für Anwendungen der Leistungselektronik
Publication reviewed:begutachtet
Release Date:2024/06/28
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