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Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package

  • This paper presents a novel fabrication concept for PCB embedded power semiconductors. Here, the semiconductors are attached to an insulated metal substrate, which is embedded in a second step into an almost-ready PCB. This approach avoids handling of bare dies during PCB production. To demonstrate the feasibility of the concept, a 1200 V / 50 A B6 bridge is designed and fabricated. The performance is evaluated and benchmarked. Compared to a conventional DBCbased power module, the conduction losses are reduced by 21% and the thermal resistance is reduced by 29%. Turn-off losses are 25% lower, while turn-on losses are about the same for both module types. A further optimization of the switching performance is possible, but requires a reduced DC-link inductance and an optimization of the gate resistance.

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Author:Ankit Bhushan Sharma, Johann Schnur, Niko Haag, Thomas Kuwan, Armin Stogel, Till HuesgenORCiD
URL / DOI:https://ieeexplore.ieee.org/document/8403121
Identifier:978-3-8007-4540-1 OPAC HS OPAC extern
Parent Title (English):CIPS 2018
Subtitle (English):10th International Conference on Integrated Power Electronics Systems: Proceedings
Publisher:VDE Verlag
Place of publication:Berlin
Document Type:conference proceeding (article)
Conference:CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, 20-22 March 2018, Stuttgart, Germany
Language:English
Year of first Publication:2018
Tag:LILIPUT
Volume:2018
Number of pages:6 Seiten
First Page:1
Last Page:6
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Research Project:Liliput – Leiterplattenintegrierter Dreipunktwechselrichter
Publication reviewed:begutachtet
Release Date:2021/01/19
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