Asymmetric Packages for Optimal Performance of GaN-HEMT using PCB Fabrication Technology
- This paper proposes an asymmetric Single-Chip-Prepackage (SCP) with thick Cu substrate for the optimum electrical and thermal performance of the GaN-HEMT devices. Additionally, the package features a Ni-based integrated thermistor. Laboratory demonstrators have been fabricated using PCB embedding technology. A full electrical characterization of the packaged device indicates full functionality. The temperature coefficient of the integrated temperature sensor is 𝛼 = 0.00541 /𝐾. Thermal characterization of the SCP shows a junction to heatsink thermal resistance Rth,jh = 3.34 K/W, which is 36 % less than the commercial reference device. A silver sinter based assembly process for system integration of SCP is introduced in view of a planar thermal interface. In a 300 kHz 48 V to 24 V buck-converter operation with 60 Arms output current, a 98% efficiency is achieved.
Author: | Ankit Bhushan Sharma, Julian WeimerORCiD, Dominik KochORCiD, Ingmar KallfassORCiDGND, Till HuesgenORCiD |
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Identifier: | 978-3-8007-5515-8 OPAC HS OPAC extern |
Parent Title (English): | PCIM Europe digital days 2021 |
Subtitle (English): | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management Proceedings, 3 - 7 May 2021 |
Publisher: | VDE Verlag |
Place of publication: | Berlin |
Document Type: | conference proceeding (article) |
Conference: | PCIM Europe 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 3, 2021 - May6, 2021, Nuremberg, Germany |
Language: | English |
Year of first Publication: | 2021 |
Tag: | DrGaN; begutachtet |
Article Number: | 112 |
Number of pages: | 8 Seiten |
First Page: | 1 |
Last Page: | 8 |
Institutes: | Fakultät Elektrotechnik |
Research focus: | FSP1: Energie |
FSP3: Produktion | |
Publication Lists: | Huesgen, Till |
Sharma, Ankit Bhushan | |
Publication reviewed: | begutachtet |
Release Date: | 2021/06/15 |