Experimental investigation of PCB embedded 1200 V IGBT/diode power pre-package under high-humidity high-temperature reverse voltage bias
- PCB embedding is an attractive packaging technology for highly integrated future power systems. Electrical and thermal benefits and limitations are well understood, but only few publications focus on reliability. Here we are addressing high-humidity high temperature reverse bias (H3TRB) tests, which are performed to gain deeper understanding of the limitations of this technology. Cu filament growth is observed on both, PCB embedded samples and silicone potted reference samples. These filaments may form a conductive path and lead to an increased leakage current in blocking mode. Electrochemical corrosion of the Cu-plated guard ring is identified as root cause.
Author: | Till HuesgenORCiD, Ankit Bhushan Sharma, Keshar Bahadur Rawal, Vladimir Polezhaev, Günther Stohrer, Frank Koch, Michael Vaas |
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DOI: | https://doi.org/10.1016/j.microrel.2022.114619 |
Identifier: | 0026-2714 OPAC HS OPAC extern |
Parent Title (English): | Microelectronics Reliability |
Publisher: | Elsevier |
Place of publication: | Amsterdam |
Document Type: | Article |
Language: | English |
Year of first Publication: | 2022 |
Tag: | MEDAL |
Volume: | 138 |
Issue: | November |
Article Number: | 114619 |
Number of pages: | 5 Seiten |
First Page: | 1 |
Last Page: | 5 |
Institutes: | Fakultät Elektrotechnik |
Research focus: | FSP1: Energie |
FSP3: Produktion | |
Publication Lists: | Huesgen, Till |
Sharma, Ankit Bhushan | |
Polezhaev, Vladimir | |
Research Project: | MEDAL – Modulares Leiterplatten-Embedding für Anwendungen der Leistungselektronik |
Publication reviewed: | begutachtet |
Release Date: | 2022/11/10 |