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Experimental investigation of PCB embedded 1200 V IGBT/diode power pre-package under high-humidity high-temperature reverse voltage bias

  • PCB embedding is an attractive packaging technology for highly integrated future power systems. Electrical and thermal benefits and limitations are well understood, but only few publications focus on reliability. Here we are addressing high-humidity high temperature reverse bias (H3TRB) tests, which are performed to gain deeper understanding of the limitations of this technology. Cu filament growth is observed on both, PCB embedded samples and silicone potted reference samples. These filaments may form a conductive path and lead to an increased leakage current in blocking mode. Electrochemical corrosion of the Cu-plated guard ring is identified as root cause.

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Author:Till HuesgenORCiD, Ankit Bhushan Sharma, Keshar Bahadur Rawal, Vladimir Polezhaev, Günther Stohrer, Frank Koch, Michael Vaas
DOI:https://doi.org/10.1016/j.microrel.2022.114619
Identifier:0026-2714 OPAC HS OPAC extern
Parent Title (English):Microelectronics Reliability
Publisher:Elsevier
Place of publication:Amsterdam
Document Type:Article
Language:English
Year of first Publication:2022
Tag:MEDAL
Volume:138
Issue:November
Article Number:114619
Number of pages:5 Seiten
First Page:1
Last Page:5
Institutes:Fakultät Elektrotechnik
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Polezhaev, Vladimir
Research Project:MEDAL – Modulares Leiterplatten-Embedding für Anwendungen der Leistungselektronik
Publication reviewed:begutachtet
Release Date:2022/11/10
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