MetadatenAuthor: | Amin Salim Obaid Al-Hinaai, Till HuesgenORCiD, Cyril Buttay, Eric Vagnon, Ildiko Ettinger, Besar Asllani, Céline Combettes |
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DOI: | https://doi.org/10.1109/THERMINIC60375.2023.10325867 |
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Identifier: | 979-8-3503-1862-3 OPAC HS OPAC extern |
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Identifier: | 979-8-3503-1863-0 OPAC HS OPAC extern |
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Parent Title (English): | 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
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Publisher: | IEEE |
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Document Type: | conference proceeding (article) |
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Conference: | 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 27-29 September 2023, Budapest, Hungary |
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Language: | English |
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Date of Publication (online): | 2023/11/24 |
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Year of first Publication: | 2023 |
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Tag: | ARCHIVE |
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Number of pages: | 6 Seiten |
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Institutes: | Fakultät Elektrotechnik |
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Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 60 Technik |
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Research focus: | FSP1: Energie |
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| FSP3: Produktion |
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Publication Lists: | Huesgen, Till |
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| Al-Hinaai, Amin |
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Research Project: | ARCHIVE – ARchitecture Ceramic for HIgh Voltage power Electronics |
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Publication reviewed: | begutachtet |
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Release Date: | 2024/03/04 |
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