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Temperature Compensated M-Shunts for Fast Transient and Low Inductive Current Measurements

  • Most current measurement techniques suffer from temperature impacts, though to a different degree. This is also true for shunt resistors, which are usually improved significantly by using temperature compensated alloy materials like Manganin(r) or by proper calibration and subsequent temperature compensation. The concept of the copper-based PCB M-shunt has already been reported to yield excellent current measurement results at room temperature. However, due to the high-temperature coefficient of copper (3920 ppm/K), the current measurement with those M-shunts showed considerable measurement errors for high temperatures and due to self-heating. This can be improved by the use of Manganin. However, still the connection of the resistor with the copper of the PCB and their respective thermal behavior needs to be considered as further possible sources of error. This paper presents challenges associated with the improvement of PCB-based shunts by temperature-compensated material, while not compromising the critical issue of bandwidth andMost current measurement techniques suffer from temperature impacts, though to a different degree. This is also true for shunt resistors, which are usually improved significantly by using temperature compensated alloy materials like Manganin(r) or by proper calibration and subsequent temperature compensation. The concept of the copper-based PCB M-shunt has already been reported to yield excellent current measurement results at room temperature. However, due to the high-temperature coefficient of copper (3920 ppm/K), the current measurement with those M-shunts showed considerable measurement errors for high temperatures and due to self-heating. This can be improved by the use of Manganin. However, still the connection of the resistor with the copper of the PCB and their respective thermal behavior needs to be considered as further possible sources of error. This paper presents challenges associated with the improvement of PCB-based shunts by temperature-compensated material, while not compromising the critical issue of bandwidth and manufacturing capability. It explicitly addresses the problems and difficulties as reported for previous development stages. In its new version, the M-shunt, represents a low inductance measurement system that can be optimised for much higher energies than the coax shunt, while not increasing the inductance introduced into the circuit. Alternatively, it can be configured for a significantly increased bandwidth and lower inductance compared to its coaxial reference.show moreshow less

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Metadaten
Author:Hauke Lutzen, Vladimir Polezhaev, Keshar Bahadur Rawal, Kayesar Ahmmed, Till HuesgenORCiD, Nando Kaminski
URL / DOI:https://ieeexplore.ieee.org/document/9862024
Identifier:978-3-8007-5757-2 OPAC HS OPAC extern
Parent Title (English):CIPS 2022; 12th International Conference on Integrated Power Electronics Systems
Publisher:VDE Verlag
Place of publication:Berlin
Document Type:conference proceeding (article)
Conference:CIPS 2022; 12th International Conference on Integrated Power Electronics Systems, 15-17 March 2022, Berlin, Germany
Language:English
Year of first Publication:2022
Tag:MShunt2
Volume:2022
Number of pages:7 Seiten
First Page:494
Last Page:499
Institutes:Fakultät Elektrotechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Polezhaev, Vladimir
Publication reviewed:begutachtet
Release Date:2022/11/10
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