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Performance Evaluation of Integrated Jet Impingement Heat Exchanger for PCB Embedded Power Modules using Dielectric Coolant

  • The increasing demand for highly compact power converters in many applications such as on-board power supplies and motor drives leads to high power loss densities. Typically, thermal management components and filters take the biggest part of the converter volume. To reduce the size, embedding technology can be used. Embedding of power semiconductors enhances the electrical performance of such devices due to reduced interconnection length. This leads to lower inductance which enables higher switching frequencies and allows more compact filter elements [1]. Direct cooling strategies pursue ways to enhance heat transfer to a coolant while reduce the heat sink size. Products like the “Danfoss ShowerPower”[2] and “Infineon Hybrid Pack”[3] show examples where cooling structures are attached directly on the backside of the power module. By omitting the thermal interface between power module and heat sink, the thermal resistance is significantly reduced. Due to superior thermal properties, water-glycol is usually applied as coolant. However,The increasing demand for highly compact power converters in many applications such as on-board power supplies and motor drives leads to high power loss densities. Typically, thermal management components and filters take the biggest part of the converter volume. To reduce the size, embedding technology can be used. Embedding of power semiconductors enhances the electrical performance of such devices due to reduced interconnection length. This leads to lower inductance which enables higher switching frequencies and allows more compact filter elements [1]. Direct cooling strategies pursue ways to enhance heat transfer to a coolant while reduce the heat sink size. Products like the “Danfoss ShowerPower”[2] and “Infineon Hybrid Pack”[3] show examples where cooling structures are attached directly on the backside of the power module. By omitting the thermal interface between power module and heat sink, the thermal resistance is significantly reduced. Due to superior thermal properties, water-glycol is usually applied as coolant. However, using a dielectric coolant enables some unique benefits: First, no electric insulation layer to coolant is required, which reduces the thermal resistance, second, corrosion problems are avoided, as dielectric coolants are typically inert, and third, the system stays safe for users in case of coolant leakage. Our approach combines these strategies to create an ultra-compact PCB embedded power module with integrated dielectric cooling. This paper is focused on the experimental thermal performance evaluation of the developed heat exchangers. It continues the theoretical work, which was presented as paper at the CIPS 2018 [5].show moreshow less

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Metadaten
Author:Johann Schnur, Ankit Bhushan Sharma, Niko Haag, Thomas Kuwan, Till HuesgenORCiD
Parent Title (German):Thermal 2019: 14th European Advanced Technology Workshop, 6 Feb 2019 - 7 Feb 2019, La Rochelle
Document Type:conference proceeding (article)
Conference:Thermal 2019: 14th European Advanced Technology Workshop, 6 Feb 2019 - 7 Feb 2019, La Rochelle
Language:English
Year of first Publication:2019
Tag:LILIPUT
Number of pages:2 Seiten
Institutes:Fakultät Elektrotechnik
Research focus:FSP1: Energie
FSP3: Produktion
Publication Lists:Huesgen, Till
Sharma, Ankit Bhushan
Research Project:Liliput – Leiterplattenintegrierter Dreipunktwechselrichter
Publication reviewed:begutachtet
Release Date:2021/01/19
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