TY - CONF A1 - Sharma, Ankit Bhushan A1 - Weimer, Julian A1 - Koch, Dominik A1 - Kallfass, Ingmar A1 - Huesgen, Till T1 - Asymmetric Packages for Optimal Performance of GaN-HEMT using PCB Fabrication Technology T2 - PCIM Europe digital days 2021 N2 - This paper proposes an asymmetric Single-Chip-Prepackage (SCP) with thick Cu substrate for the optimum electrical and thermal performance of the GaN-HEMT devices. Additionally, the package features a Ni-based integrated thermistor. Laboratory demonstrators have been fabricated using PCB embedding technology. A full electrical characterization of the packaged device indicates full functionality. The temperature coefficient of the integrated temperature sensor is 𝛼 = 0.00541 /𝐾. Thermal characterization of the SCP shows a junction to heatsink thermal resistance Rth,jh = 3.34 K/W, which is 36 % less than the commercial reference device. A silver sinter based assembly process for system integration of SCP is introduced in view of a planar thermal interface. In a 300 kHz 48 V to 24 V buck-converter operation with 60 Arms output current, a 98% efficiency is achieved. KW - begutachtet KW - DrGaN Y1 - 2021 UR - https://opus4.kobv.de/opus4-hs-kempten/frontdoor/index/index/docId/821 SN - 978-3-8007-5515-8 SP - 1 EP - 8 PB - VDE Verlag CY - Berlin ER -