TY - JOUR A1 - Huesgen, Till A1 - Sharma, Ankit Bhushan A1 - Rawal, Keshar Bahadur A1 - Polezhaev, Vladimir A1 - Stohrer, Günther A1 - Koch, Frank A1 - Vaas, Michael T1 - Experimental investigation of PCB embedded 1200 V IGBT/diode power pre-package under high-humidity high-temperature reverse voltage bias T2 - Microelectronics Reliability N2 - PCB embedding is an attractive packaging technology for highly integrated future power systems. Electrical and thermal benefits and limitations are well understood, but only few publications focus on reliability. Here we are addressing high-humidity high temperature reverse bias (H3TRB) tests, which are performed to gain deeper understanding of the limitations of this technology. Cu filament growth is observed on both, PCB embedded samples and silicone potted reference samples. These filaments may form a conductive path and lead to an increased leakage current in blocking mode. Electrochemical corrosion of the Cu-plated guard ring is identified as root cause. KW - MEDAL Y1 - 2022 UR - https://opus4.kobv.de/opus4-hs-kempten/frontdoor/index/index/docId/1463 SN - 0026-2714 VL - 138 IS - November SP - 1 EP - 5 PB - Elsevier CY - Amsterdam ER -