@inproceedings{AlHinaaiHuesgenButtayetal.2022, author = {Amin Salim Obaid Al-Hinaai and Till Huesgen and Cyril Buttay and Richard Zeitler and Daniela Meyer}, title = {A novel integrated cooling packaging for high power density semiconductors}, booktitle = {28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022), Sep 2022, Dublin, Ireland}, pages = {1 -- 6}, doi = {10.1109/THERMINIC57263.2022.9950643}, year = {2022}, }