TY - CONF A1 - Al-Hinaai, Amin Salim Obaid A1 - Huesgen, Till A1 - Buttay, Cyril A1 - Vagnon, Eric A1 - Zeitler, Richard A1 - Meyer, Daniela T1 - A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics T2 - 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) N2 - This work investigates a packaging solution for high voltage semiconductors (20 kV), allowing for a dramatic reduction in size and complexity of power electronics modules. The standard packaging structures typically introduce a competition between electrical insulation (which requires thick insulating layers) and thermal performance (where thin, high thermal conductivity layers are preferred). Here, we introduce a concept which addresses this competition and is based on direct cooling using dielectric liquid. Single-chip heatsinks are designed, optimized using computational fluid dynamics (CFD), built and tested. KW - ARCHIVE Y1 - 2022 UR - https://opus4.kobv.de/opus4-hs-kempten/frontdoor/index/index/docId/1464 SN - 978-1-7281-9933-7 SN - 978-1-7281-9295-6 SP - 1 EP - 6 PB - IEEE CY - Piscataway ER -