@inproceedings{HuesgenPolezhaevSharmaetal.2021, author = {Till Huesgen and Vladimir Polezhaev and Ankit Bhushan Sharma and Chunlei Liu and Mohammadhossein Montazerian and Patrick Stadler and Niko Pavliček and Giovanni Salvatore}, title = {Reliability Screening of a Hybrid DBC/PCB power semiconductor prepackage}, booktitle = {2021 23rd European Microelectronics and Packaging Conference \& Exhibition (EMPC)}, pages = {1 -- 5}, doi = {10.23919/EMPC53418.2021.9584983}, year = {2021}, }