TY - CONF A1 - Al-Hinaai, Amin Salim Obaid A1 - Huesgen, Till A1 - Buttay, Cyril A1 - Vagnon, Eric A1 - Ettinger, Ildiko A1 - Asllani, Besar A1 - Combettes, CĂ©line T1 - An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules T2 - 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) N2 - This study investigated the thermal performance of a packaging solution designed to manage the electrical isolation and cooling of high voltage ( ) SiC power semiconductor > 3300 V devices. The proposed packaging merges the ceramic substrate and the heat exchanger into a single component, streamlining the overall design. Specifically, a novel heat exchanger is developed for a multi-chip module (20 kV), utilizing a combination of jet impingement and channel- flow cooling techniques. Computational fluid dynamics (CFD) simulations and experimental validation are conducted on a multi-chip module to assess the thermal resistance of this new cooling solution. The results demonstrate a low thermal resistivity of 0.118 cm2K/W, indicating the potential for improved cooling performance in high voltage and power density semiconductor applications. KW - ARCHIVE Y1 - 2023 UR - https://opus4.kobv.de/opus4-hs-kempten/frontdoor/index/index/docId/2154 SN - 979-8-3503-1862-3 SN - 979-8-3503-1863-0 PB - IEEE ER -