Micro-additives and their impact on tensile and fracture performance of solder
| Author: | Anna Steenmann, Jessica Richter, Thomas Licht |
|---|---|
| Qualitätssicherung: | peer reviewed |
| Fachbereich/Einrichtung: | Hochschule Düsseldorf / Fachbereich - Elektro- & Informationstechnik |
| Document Type: | Article |
| Year of Completion: | 2023 |
| Language of Publication: | English |
| Publisher: | Elsevier |
| Parent Title (English): | Microelectronics Reliability |
| Volume: | 150 |
| Article Number: | 115107 |
| Page Number: | 5 |
| DOI: | https://doi.org/10.1016/j.microrel.2023.115107 |
| ISSN: | 0026-2714 |
| Tag: | Lead-free solder; Micro additives; SAC solder; Tensile tests; indicator of reliability |
| GND Keyword: | Zugversuch; Lot (Werkstoff) |
| Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |
| Licence (German): | |
| Release Date: | 2024/10/01 |