TY - JOUR A1 - Richter, Jessica A1 - Steenmann, Anna A1 - Schellscheidt, Benjamin A1 - Licht, Thomas T1 - On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C JF - International Symposium on Microelectronics Y1 - 2019 U6 - https://doi.org/10.4071/2380-4505-2019.1.000530 VL - 2019 IS - 1 SP - 000530 EP - 000534 PB - IMAPS ER - TY - JOUR A1 - Steenmann, Anna A1 - Richter, Jessica A1 - Licht, Thomas T1 - Micro-additives and their impact on tensile and fracture performance of solder JF - Microelectronics Reliability KW - Zugversuch KW - Lot (Werkstoff) KW - Tensile tests KW - indicator of reliability KW - Micro additives KW - SAC solder KW - Lead-free solder Y1 - 2023 U6 - https://doi.org/10.1016/j.microrel.2023.115107 SN - 0026-2714 VL - 150 PB - Elsevier ER -