TY - JOUR A1 - Richter, Jessica A1 - Steenmann, Anna A1 - Schellscheidt, Benjamin A1 - Licht, Thomas T1 - On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C JF - International Symposium on Microelectronics Y1 - 2019 U6 - https://doi.org/10.4071/2380-4505-2019.1.000530 VL - 2019 IS - 1 SP - 000530 EP - 000534 PB - IMAPS ER -