TY - JOUR A1 - Steenmann, Anna A1 - Richter, Jessica A1 - Licht, Thomas T1 - Micro-additives and their impact on tensile and fracture performance of solder JF - Microelectronics Reliability KW - Zugversuch KW - Lot (Werkstoff) KW - Tensile tests KW - indicator of reliability KW - Micro additives KW - SAC solder KW - Lead-free solder Y1 - 2023 U6 - https://doi.org/10.1016/j.microrel.2023.115107 SN - 0026-2714 VL - 150 PB - Elsevier ER -