@article{RichterSteenmannSchellscheidtetal.2019, author = {Richter, Jessica and Steenmann, Anna and Schellscheidt, Benjamin and Licht, Thomas}, title = {On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C}, series = {International Symposium on Microelectronics}, volume = {2019}, journal = {International Symposium on Microelectronics}, number = {1}, publisher = {IMAPS}, organization = {IMAPS}, doi = {10.4071/2380-4505-2019.1.000530}, pages = {000530 -- 000534}, year = {2019}, language = {en} }