TY  - JOUR
U1  - Wissenschaftlicher Artikel
A1  - Steenmann, Anna
A1  - Richter, Jessica
A1  - Licht, Thomas
T1  - Micro-additives and their impact on tensile and fracture performance of solder
JF  - Microelectronics Reliability
KW  - Zugversuch
KW  - Lot (Werkstoff)
KW  - Tensile tests
KW  - indicator of reliability
KW  - Micro additives
KW  - SAC solder
KW  - Lead-free solder
Y1  - 2023
SN  - 0026-2714
SS  - 0026-2714
U6  - https://doi.org/10.1016/j.microrel.2023.115107
DO  - https://doi.org/10.1016/j.microrel.2023.115107
VL  - 150
AR  - 115107
S2  - 115107
SP  - 5
PB  - Elsevier
ER  -