TY - JOUR A1 - Steenmann, Anna A1 - Richter, Jessica A1 - Licht, Thomas T1 - Micro-additives and their impact on tensile and fracture performance of solder T2 - Microelectronics Reliability KW - Zugversuch KW - Lot (Werkstoff) KW - Tensile tests KW - indicator of reliability KW - Micro additives KW - SAC solder KW - Lead-free solder Y1 - 2023 UR - https://opus4.kobv.de/opus4-hs-duesseldorf/frontdoor/index/index/docId/4614 SN - 0026-2714 VL - 150 PB - Elsevier ER -