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Piezoresistive bond lines for timber construction monitoring—experimental scale-up

  • Several laboratory studies and experiments have demonstrated the usability of polymer films filled with electrically conductive filler as piezoresistive material. Applied to adhesives, the glue lines of wood products can achieve multifunctional—thus bonding and piezoresistive/strain sensing—properties. Based on critical load areas in timber constructions, upscaled test setups for simplified load situations were designed, especially with regard to a stress-free electrical contact. In a second step, another upscaling was done to small glulam beams. Based on an experimental test sequence, the piezoresistive reactions as well as the behaviour until failure were analysed. The results show in all cases that a piezoresistive reaction of the multifunctionally bonded specimens was measurable, giving a difference in the extent of relative change. Additionally, measured phenomena like inverse piezoresistive reactions, electrical resistance drift and the absence of a piezoresistive reaction were discussed, based on additional strain analysis bySeveral laboratory studies and experiments have demonstrated the usability of polymer films filled with electrically conductive filler as piezoresistive material. Applied to adhesives, the glue lines of wood products can achieve multifunctional—thus bonding and piezoresistive/strain sensing—properties. Based on critical load areas in timber constructions, upscaled test setups for simplified load situations were designed, especially with regard to a stress-free electrical contact. In a second step, another upscaling was done to small glulam beams. Based on an experimental test sequence, the piezoresistive reactions as well as the behaviour until failure were analysed. The results show in all cases that a piezoresistive reaction of the multifunctionally bonded specimens was measurable, giving a difference in the extent of relative change. Additionally, measured phenomena like inverse piezoresistive reactions, electrical resistance drift and the absence of a piezoresistive reaction were discussed, based on additional strain analysis by digital image correlation. A model of macroscopic and microscopic strains influencing the piezoresistive reaction of the electrically conductive bond line in wood was used to explain all experimental results. Finally, a first scale-up of piezoresistive bond lines from laboratory samples to glulam beams was possible and successful.show moreshow less

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Author:Christoph WinklerORCiD, Stefan Haase, Ulrich Schwarz, Markus Jahreis
URN:urn:nbn:de:kobv:eb1-opus-1959
DOI:https://doi.org/10.1007/s00226-021-01305-6
ISSN:0043-7719
Parent Title (German):Wood Science and Technology
Publisher:Springer Nature
Document Type:Article
Language:English
Year of Completion:2021
Date of Publication (online):2021/09/10
Date of first Publication:2021/06/24
Publishing Institution:Hochschule für nachhaltige Entwicklung Eberswalde
Release Date:2021/09/10
Volume:55
Issue:4
Page Number:22
First Page:1379
Last Page:1400
Institutions / Departments:Fachbereich Holzingenieurwesen
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften
open_access (DINI-Set):open_access
Funding by the HNEE:Projekt DEAL
University Bibliography:University Bibliography
Zweitveröffentlichung
Peer-Review / Referiert
Licence (German):License LogoCreative Commons - CC BY - Namensnennung 4.0 International
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