<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>575</id>
    <completedYear>2020</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>1-4</issue>
    <volume>96</volume>
    <type>article</type>
    <publisherName>Taylor &amp; Francis</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Influence of polymer/filler composition and processing on the properties of multifunctional adhesive wood bonds from polyurethane prepolymers II: electrical sensitivity in compression</title>
    <abstract language="eng">Electrically conductive fillers enhance the functionality of adhesive bondlines by inducing a strain-dependent electrical resistance. Applied as sensor elements in engineered timber, these multifunctional adhesive bondlines are influenced by a lot of process parameters, including the dispersion process, manufacturing parameters and postcuring conditions. Additionally, the sensitivity of these sensor elements is counteracted by instabilities of the piezoresistivity. A setup and analysing method of the piezoresistive response have been developed, which includes sensitivity as well as instability effects. With this setup, the quality of the piezoresistive bondline has been assessed by three experiments, varying 10 influencing factors. The piezoresistive response was investigated in compression perpendicular to the bondline. It was shown that the electrical sensitivity in compression and stability of the piezoresistive bondline can be influenced by polymer formulation, filler type, filler content as well as the press temperature, glue spread, dispersion technique and thermal postcuring.</abstract>
    <parentTitle language="eng">The Journal of Adhesion</parentTitle>
    <identifier type="doi">10.1080/00218464.2019.1652602</identifier>
    <identifier type="issn">0021-8464</identifier>
    <identifier type="issn">1545-5823</identifier>
    <identifier type="urn">urn:nbn:de:kobv:eb1-opus-5756</identifier>
    <licence>Urheberrechtsschutz</licence>
    <author>Christoph Winkler</author>
    <author>Jesco Schäfer</author>
    <author>Christopher Jager</author>
    <author>Johannes Konnerth</author>
    <author>Ulrich Schwarz</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Conductive adhesives; adhesives for wood; piezoresistivity; signal stability; adhesives with nanoparticles; civil engineering</value>
    </subject>
    <collection role="institutes" number="">Fachbereich Holzingenieurwesen</collection>
    <collection role="Hochschulbibliographie" number=""/>
    <collection role="Hochschulbibliographie" number="">Referiert</collection>
    <thesisPublisher>Hochschule für nachhaltige Entwicklung Eberswalde</thesisPublisher>
  </doc>
</export-example>
