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Capacitive MEMS microphones are now widely used for mobile phones and headsets. The frequency response of MEMS microphones is influenced by the package geometry. This can be applied to tune the performance of the microphone in the system. Packages with small sound inlet holes are acoustic low-pass filters. The cut-off frequency is determined by the diameter of the holes. In previous work we did not find sufficient agreement between a lumped element simulation and the measured frequency response of the microphones. Now we measured the acoustic resistance of small sound inlet holes directly. The measured resistances agree well with calculated values. The frequency response of MEMS microphones was measured for different sound hole diameters and lengths. The results are in good agreement with calculated transfer functions of the package.