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Flip chip MEMS microphone package with large acoustic reference volume

  • MEMS microphones must be further miniaturized for use in mobile devices. So we developed packaging technologies for MEMS microphones using flip chip technology instead of wire bonding. The first two generations have the sound hole in a ceramic interposer at the bottom side of the package. Now a new flip chip microphone package with the sound hole on the top side has been developed. The new package technology combines a large acoustic reference volume for good signal to noise ratio with small size. Compared to other microphone packages the sensitivity is improved by 3 dB. The front volume is small to avoid resonances in the acoustic frequency range.

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Metadaten
Author:Gregor FeiertagORCiD, Wolfgang Pahl, Matthias Winter, Anton Seidl, Stefan Seitz, Christian Siegel, Andreas Beer
URN:urn:nbn:de:bvb:m347-opus-3066
DOI:https://doi.org/10.1016/j.proeng.2010.09.121
Parent Title (English):Procedia Engineering
Publisher:Elsevier Ltd.
Document Type:Article
Language:English
Date of Publication (online):2022/01/25
Year of first Publication:2010
Publishing Institution:Hochschule für angewandte Wissenschaften München
Contributing Corporation:Eurosensors XXIV, 5.-8. September 2010, Linz
Release Date:2022/01/25
GND Keyword:Flip-Chip-TechnologieGND; MEMSGND; MikrofonGND
Page Number:4
First Page:355
Last Page:358
Note:
Sonderdruck aus: Procedia Engineering; Vol. 5 (2010), Seite 355–358
Departments and Institutes:Fakultäten der Hochschule München / FK 04 Fakultät für Elektrotechnik und Informationstechnik
Dewey Decimal Classification:6 Technik, Medizin, angewandte Wissenschaften / 60 Technik
Illustrations:Illustration/en
Illustrations:grafische Darstellung/en
Licence (German):Creative Commons - CC BY-NC-ND - Namensnennung - Nicht kommerziell - Keine Bearbeitungen 4.0 International
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