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Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package

  • A highly miniturized piezoresistive humidity sensor has been developed. The starting point of the developement was a 1x1 mm2 piezsoresistive pressure sensor chip. As sensing material, a polyimide was used that swells with increasing adsorption of water molecules. To convert the swelling into an electrical signal, a thin layer of the polimide was deposited onto the bending plate of the pressure sensor. The humidity sensor was characterized in a climate chamber. The measurements show a sensittivity of 0.25 mV per percent relative humidity (%RH) and a non-linearity of 3.1 % full scale (FS) in the range of 30-80%RH. A high cross-sensitivity to temperature of around 0.5 mV°C was measured, so temperature compensation is necessary. For stress-free packaging of the sensor chip, a novel packaging technology was developed.

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Metadaten
Author:Gregor FeiertagORCiD, M. Sax, Tobias Waber, Wolfgang Pahl, S. Stufle, Anton Leidl
URN:urn:nbn:de:bvb:m347-dtl-0000000910
DOI:https://doi.org/10.5194/jsss-3-167-2014
Parent Title (English):Journal of Sensors and Sensor Systems
Publisher:Copernicus Publications
Document Type:Article
Language:English
Date of Publication (online):2022/02/07
Date of first Publication:2014/08/08
Publishing Institution:Hochschule für angewandte Wissenschaften München
Release Date:2022/02/07
GND Keyword:ElektrotechnikGND; DrucksensorGND; SmartphoneGND
Page Number:8
First Page:168
Last Page:175
Departments and Institutes:Fakultäten der Hochschule München / FK 04 Fakultät für Elektrotechnik und Informationstechnik
Illustrations:grafische Darstellung/en
Illustrations:Illustration/en
Licence (German):Creative Commons - CC BY - Namensnennung 4.0 International
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