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Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package
- A highly miniturized piezoresistive humidity sensor has been developed. The starting point of the developement was a 1x1 mm2 piezsoresistive pressure sensor chip. As sensing material, a polyimide was used that swells with increasing adsorption of water molecules. To convert the swelling into an electrical signal, a thin layer of the polimide was deposited onto the bending plate of the pressure sensor. The humidity sensor was characterized in a climate chamber. The measurements show a sensittivity of 0.25 mV per percent relative humidity (%RH) and a non-linearity of 3.1 % full scale (FS) in the range of 30-80%RH. A high cross-sensitivity to temperature of around 0.5 mV°C was measured, so temperature compensation is necessary. For stress-free packaging of the sensor chip, a novel packaging technology was developed.
Author: | Gregor FeiertagORCiD, M. Sax, Tobias Waber, Wolfgang Pahl, S. Stufle, Anton Leidl |
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URN: | urn:nbn:de:bvb:m347-dtl-0000000910 |
DOI: | https://doi.org/10.5194/jsss-3-167-2014 |
Parent Title (English): | Journal of Sensors and Sensor Systems |
Publisher: | Copernicus Publications |
Document Type: | Article |
Language: | English |
Date of Publication (online): | 2022/02/07 |
Date of first Publication: | 2014/08/08 |
Publishing Institution: | Hochschule für angewandte Wissenschaften München |
Release Date: | 2022/02/07 |
GND Keyword: | ElektrotechnikGND; DrucksensorGND; SmartphoneGND |
Page Number: | 8 |
First Page: | 168 |
Last Page: | 175 |
Departments and Institutes: | Fakultäten der Hochschule München / FK 04 Fakultät für Elektrotechnik und Informationstechnik |
Illustrations: | grafische Darstellung/en |
Illustrations: | Illustration/en |
Licence (German): | Creative Commons - CC BY - Namensnennung 4.0 International |