TY - JOUR A1 - Feiertag, Gregor A1 - Sax, M. A1 - Waber, Tobias A1 - Pahl, Wolfgang A1 - Stufle, S. A1 - Leidl, Anton T1 - Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package T2 - Journal of Sensors and Sensor Systems N2 - A highly miniturized piezoresistive humidity sensor has been developed. The starting point of the developement was a 1x1 mm2 piezsoresistive pressure sensor chip. As sensing material, a polyimide was used that swells with increasing adsorption of water molecules. To convert the swelling into an electrical signal, a thin layer of the polimide was deposited onto the bending plate of the pressure sensor. The humidity sensor was characterized in a climate chamber. The measurements show a sensittivity of 0.25 mV per percent relative humidity (%RH) and a non-linearity of 3.1 % full scale (FS) in the range of 30-80%RH. A high cross-sensitivity to temperature of around 0.5 mV°C was measured, so temperature compensation is necessary. For stress-free packaging of the sensor chip, a novel packaging technology was developed. KW - Elektrotechnik KW - Drucksensor KW - Smartphone Y1 - 2022 UR - https://opus4.kobv.de/opus4-hm/frontdoor/index/index/docId/345 UR - https://nbn-resolving.org/urn:nbn:de:bvb:m347-dtl-0000000910 SP - 168 EP - 175 PB - Copernicus Publications ER -