TY - JOUR A1 - Feiertag, Gregor A1 - Pahl, Wolfgang A1 - Winter, Matthias A1 - Seidl, Anton A1 - Seitz, Stefan A1 - Siegel, Christian A1 - Beer, Andreas T1 - Flip chip MEMS microphone package with large acoustic reference volume T2 - Procedia Engineering N2 - MEMS microphones must be further miniaturized for use in mobile devices. So we developed packaging technologies for MEMS microphones using flip chip technology instead of wire bonding. The first two generations have the sound hole in a ceramic interposer at the bottom side of the package. Now a new flip chip microphone package with the sound hole on the top side has been developed. The new package technology combines a large acoustic reference volume for good signal to noise ratio with small size. Compared to other microphone packages the sensitivity is improved by 3 dB. The front volume is small to avoid resonances in the acoustic frequency range. KW - Flip-Chip-Technologie KW - MEMS KW - Mikrofon Y1 - 2022 UR - https://opus4.kobv.de/opus4-hm/frontdoor/index/index/docId/306 UR - https://nbn-resolving.org/urn:nbn:de:bvb:m347-opus-3066 N1 - Sonderdruck aus: Procedia Engineering; Vol. 5 (2010), Seite 355–358 SP - 355 EP - 358 PB - Elsevier Ltd. ER -