Transient thermal analysis for VCSEL Diodes
Author: | Maximilian SchmidORCiD, Marcel Momberg, Marcel KettelgerdesORCiD, Gordon ElgerORCiD |
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Language: | English |
Document Type: | Conference Paper |
Conference: | 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Budapest (Hungary), 27.-29.09.2023 |
Year of first Publication: | 2023 |
published in (English): | 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
Publisher: | IEEE |
Place of publication: | Piscataway |
ISBN: | 979-8-3503-1862-3 |
ISSN: | 2474-1523 |
Pages: | 6 |
Review: | nein |
Open Access: | nein |
Related Identifier: | https://doi.org/10.1109/THERMINIC60375.2023.10325906 |
Faculties / Institutes / Organizations: | Fakultät Elektro- und Informationstechnik |
Institut für Innovative Mobilität (IIMo) | |
Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur" | |
Release Date: | 2023/11/28 |