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Reliability of SAC Solders under Low and High Stress Conditions

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Author:Maximilian SchmidORCiD, Joseph Hermann, Sri Krishna BhogarajuORCiD, Gordon ElgerORCiD
Language:English
Document Type:Conference Paper
Conference:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 13.-16.09.2022
Year of first Publication:2022
published in (English):2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
Publisher:IEEE
Place of publication:Piscataway
ISBN:978-1-6654-8947-8
First Page:553
Last Page:559
Review:peer-review
Open Access:nein
Tag:SAC solder; SAM; reliability; solder joint cracking; transient thermal analysis
Related Identifier:https://doi.org/10.1109/ESTC55720.2022.9939394
Faculties / Institutes / Organizations:Fakultät Elektro- und Informationstechnik
Institut für Innovative Mobilität (IIMo)
Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"
Release Date:2022/11/15