Reliability of SAC Solders under Low and High Stress Conditions
Author: | Maximilian SchmidORCiD, Joseph Hermann, Sri Krishna BhogarajuORCiD, Gordon ElgerORCiD |
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Language: | English |
Document Type: | Conference Paper |
Conference: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu (Romania), 13.-16.09.2022 |
Year of first Publication: | 2022 |
published in (English): | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) |
Publisher: | IEEE |
Place of publication: | Piscataway |
ISBN: | 978-1-6654-8947-8 |
First Page: | 553 |
Last Page: | 559 |
Review: | peer-review |
Open Access: | nein |
Tag: | SAC solder; SAM; reliability; solder joint cracking; transient thermal analysis |
Related Identifier: | https://doi.org/10.1109/ESTC55720.2022.9939394 |
Faculties / Institutes / Organizations: | Fakultät Elektro- und Informationstechnik |
Institut für Innovative Mobilität (IIMo) | |
Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur" | |
Release Date: | 2022/11/15 |