The search result changed since you submitted your search request. Documents might be displayed in a different sort order.
  • search hit 12 of 52
Back to Result List

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II - Reliability

Metadaten
Author:Maximilian SchmidORCiD, Andreas ZippeliusORCiD, Alexander HanßORCiD, Stephan Böckhorst, Gordon ElgerORCiD
Language:English
Document Type:Article
Year of first Publication:2023
published in (English):IEEE Transactions on Device and Materials Reliability
Publisher:IEEE
Place of publication:Piscataway
ISSN:1558-2574
ISSN:1530-4388
Volume:23
Issue:3
First Page:419
Last Page:429
Review:peer-review
Open Access:ja
Version:published
Tag:LED; X-ray; non-destructive testing; reliability; scanning acoustic microscopy (SAM); solder; thermal impedance (Zth); thermal resistant (Rth); transient thermal analysis (TTA)
URN:urn:nbn:de:bvb:573-39651
Related Identifier:https://doi.org/10.1109/TDMR.2023.3300355
Faculties / Institutes / Organizations:Fakultät Elektro- und Informationstechnik
Institut für Innovative Mobilität (IIMo)
Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur"
Licence (German):License Logo Creative Commons BY-NC-ND 4.0
Release Date:2023/09/19