Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II - Reliability
Author: | Maximilian SchmidORCiD, Andreas ZippeliusORCiD, Alexander HanßORCiD, Stephan Böckhorst, Gordon ElgerORCiD |
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Language: | English |
Document Type: | Article |
Year of first Publication: | 2023 |
published in (English): | IEEE Transactions on Device and Materials Reliability |
Publisher: | IEEE |
Place of publication: | Piscataway |
ISSN: | 1558-2574 |
ISSN: | 1530-4388 |
Volume: | 23 |
Issue: | 3 |
First Page: | 419 |
Last Page: | 429 |
Review: | peer-review |
Open Access: | ja |
Version: | published |
Tag: | LED; X-ray; non-destructive testing; reliability; scanning acoustic microscopy (SAM); solder; thermal impedance (Zth); thermal resistant (Rth); transient thermal analysis (TTA) |
URN: | urn:nbn:de:bvb:573-39651 |
Related Identifier: | https://doi.org/10.1109/TDMR.2023.3300355 |
Faculties / Institutes / Organizations: | Fakultät Elektro- und Informationstechnik |
Institut für Innovative Mobilität (IIMo) | |
Fraunhofer-Anwendungszentrum "Vernetzte Mobilität und Infrastruktur" | |
Licence (German): | ![]() |
Release Date: | 2023/09/19 |