Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach
Author: | Joel Luther Thambi, Ulrich TetzlaffORCiD, Andreas Schiessl, Klaus-Dieter Lang, Manuela Waltz |
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Language: | English |
Document Type: | Article |
Year of first Publication: | 2020 |
published in (English): | Microelectronics Reliability |
Publisher: | Elsevier |
Place of publication: | Amsterdam |
ISSN: | 0026-2714 |
Volume: | 2020 |
Issue: | 106 |
Pages: | 10 |
Article Number: | 113560 |
Review: | peer-review |
Open Access: | nein |
Version: | published |
Tag: | Bulk solder; Chip capacitor; Component testing; Durability; Experimental analysis; FEA; FKM guideline; Fatigue; Harmonic frequency; High cycle fatigue (HCF); Local stress; Material characterisation; Roughness; SnAgCu; Solder alloys; Solder joint failure; Stress gradient; Surface mount technology (SMT); Transformer; Vibration |
Related Identifier: | https://doi.org/10.1016/j.microrel.2019.113560 |
Faculties / Institutes / Organizations: | Fakultät Maschinenbau |
Release Date: | 2022/03/04 |