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Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach

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Metadaten
Author:Joel Luther Thambi, Ulrich TetzlaffORCiD, Andreas Schiessl, Klaus-Dieter Lang, Manuela Waltz
Language:English
Document Type:Article
Year of first Publication:2020
published in (English):Microelectronics Reliability
Publisher:Elsevier
Place of publication:Amsterdam
ISSN:0026-2714
Volume:2020
Issue:106
Pages:10
Article Number:113560
Review:peer-review
Open Access:nein
Version:published
Tag:Bulk solder; Chip capacitor; Component testing; Durability; Experimental analysis; FEA; FKM guideline; Fatigue; Harmonic frequency; High cycle fatigue (HCF); Local stress; Material characterisation; Roughness; SnAgCu; Solder alloys; Solder joint failure; Stress gradient; Surface mount technology (SMT); Transformer; Vibration
Related Identifier:https://doi.org/10.1016/j.microrel.2019.113560
Faculties / Institutes / Organizations:Fakultät Maschinenbau
Release Date:2022/03/04