TY - CHAP A1 - Elger, Gordon A1 - Liu, E A1 - Conti, Fosca A1 - Signorini, Raffaella A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna T1 - Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724533 KW - Conferences KW - Microelectronics KW - Micromechanical devices Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724533 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - May, Willy A1 - Pforr, Johannes T1 - Design of integrated inductors in multi-phase buck/boost converters including operation with deactivated phases T2 - PCIM Europe 2019 Y1 - 2019 UR - https://www.vde-verlag.de/proceedings-de/564938051.html SN - 978-3-8007-4938-6 SP - 392 EP - 399 PB - VDE CY - Berlin ER - TY - CHAP A1 - Elger, Gordon A1 - Mokhtari, Omid A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Meier, Markus A1 - Schweigart, Helmut T1 - Analyse der Reaktionsprodukte von Metall-Formiaten im rückstandfreien Lötprozess T2 - GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten UR - https://www.vde-verlag.de/proceedings-de/455185053.html Y1 - 2020 UR - https://www.vde-verlag.de/proceedings-de/455185053.html SN - 978-3-8007-5185-3 SN - 978-3-8007-5186-0 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization T2 - International Symposium on Microelectronics UR - https://doi.org/10.4071/2380-4505-2019.1.000387 Y1 - 2019 UR - https://doi.org/10.4071/2380-4505-2019.1.000387 SN - 2380-4505 SN - 1085-8024 VL - 2019 IS - 1 SP - 387 EP - 392 PB - IMAPS CY - Pittsburgh ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Elger, Gordon T1 - Improved sinterability of particles to substrates by surface modifications on substrate metallization T2 - Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 Y1 - 2019 UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 SN - 2380-4491 VL - 2019 IS - HiTen SP - 66 EP - 70 PB - IMAPS CY - Pittsburgh (PA) ER - TY - CHAP A1 - Signorini, Raffaella A1 - Conti, Fosca A1 - Brugnolotto, Enrico A1 - Pedron, Danilo A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy T2 - Integrated Optics: Design, Devices, Systems, and Applications V UR - https://doi.org/10.1117/12.2520992 Y1 - 2019 UR - https://doi.org/10.1117/12.2520992 SN - 978-1-5106-2729-1 N1 - Presentation + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923548 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923548 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Conti, Fosca A1 - Pedron, Danilo A1 - Signorini, Raffaella A1 - Elger, Gordon T1 - Investigation of thermomechanical local stress induced in assembled GaN LEDs T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923629 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923629 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level T2 - 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC.2019.00320 KW - reliability KW - thermal KW - silver sintering KW - MOSFET KW - measurment equipment Y1 - 2019 UR - https://doi.org/10.1109/ECTC.2019.00320 SN - 978-1-7281-1499-6 SP - 2324 EP - 2330 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bogdanovs, Arturs A1 - Krievs, Oskars A1 - Pforr, Johannes T1 - Indirect Multiple DC Link Current Sensing Using Op-Amp Circuits in a Three-Phase Three-Level PWM Inverter T2 - PCIM Europe digital days 2021 UR - https://www.vde-verlag.de/proceedings-de/565515217.html Y1 - 2021 UR - https://www.vde-verlag.de/proceedings-de/565515217.html SN - 978-3-8007-5515-8 SP - 1614 EP - 1621 PB - VDE CY - Berlin ER - TY - CHAP A1 - Bogdanovs, Arturs A1 - Krievs, Oskars A1 - Pforr, Johannes T1 - Fault Detection using Indirect DC Link Current Measurement Technique in Multiphase DC Converter with Coupled Inductor T2 - 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe) UR - https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570190 KW - Multiphase Converter KW - Faults KW - Measurements KW - Coupled inductor KW - Failure modes Y1 - 2021 UR - https://doi.org/10.23919/EPE21ECCEEurope50061.2021.9570190 SN - 978-9-0758-1537-5 PB - IEEE CY - Piscataway ER -