TY - CHAP A1 - Zippelius, Andreas A1 - Strobl, Tobias A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Hoffmann, Alwin A1 - Elger, Gordon T1 - Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks T2 - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC55720.2022.9939465 KW - Solder Joints KW - LED KW - non-destructive testing KW - Machine Learning KW - Scanning Acoustic Microscopy (SAM) KW - Transient Thermal Analysis (TTA), Convolutional Neural Network (CNN) Y1 - 2022 UR - https://doi.org/10.1109/ESTC55720.2022.9939465 SN - 978-1-6654-8947-8 SP - 566 EP - 575 PB - IEEE CY - Piscataway ER -