TY - JOUR A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy JF - Journal of Raman Spectroscopy N2 - Local thermomechanical stress can cause failures in semiconductor packages during long-time operation under harsh environmental conditions. This study helps to explain the packaging-induced stress in blue GaN-LEDs soldered onto copper substrates using AuSn alloy as lead-free interconnect material. Based on the finite element method, a virtual prototype is developed to simulate the thermomechanical behavior and stress in the LED and in the complete LED/AuSn/Cu assembly considering plastic and viscoplastic strain. The investigations were performed by varying the temperature between −50°C and 180°C. To validate the model, the simulation results are compared to experimental data collected with Raman spectroscopy. Studies of the urn:x-wiley:03770486:media:jrs5947:jrs5947-math-0003 phonon mode of GaN semiconductor are elaborated to understand the induced thermomechanical stress. The model enables evaluation of the stress in the interfaces of the assembly, which otherwise cannot be accessed by measurements. It serves to predict how assemblies would perform, before committing resources to build a physical prototype. UR - https://doi.org/10.1002/jrs.5947 KW - finite element method KW - gallium nitride (GaN) KW - LED KW - semiconductor KW - thermomechanical stress Y1 - 2020 UR - https://doi.org/10.1002/jrs.5947 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-9438 SN - 1097-4555 VL - 51 IS - 10 SP - 2083 EP - 2094 PB - Wiley CY - Chichester ER - TY - CHAP A1 - Liu, E A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates T2 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 KW - Performance evaluation KW - Analytical models KW - Compressive stress KW - Thermomechanical processes KW - Data models KW - Microelectronics KW - Finite element analysis Y1 - 2021 UR - https://doi.org/10.1109/EuroSimE52062.2021.9410869 SN - 978-1-6654-1373-2 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Elger, Gordon T1 - Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics JF - Applied Sciences N2 - Reliability is one of the major requirements for power and opto-electronic devices across all segments. High operation temperature and/or high thermomechanical stress cause defects and degradation of materials and interconnects, which may lead to malfunctions with costly or even life-threatening consequences. To avoid or at least reduce failures, nondestructive testing (NDT) methods are common within development and production of power and opto-electronics. Currently, the dominating NDT methods are X-ray, scanning acoustic microscopy (SAM), and transient thermal analysis (TTA). However, they have different strengths and weaknesses with respect to materials and mechanical designs. This paper compares these NDT methods for different interconnect technologies, i.e., reflow soldering, adhesive, and sintered interconnection. While X-ray provided adequate results for soldered interfaces, inspection of adhesives and sintered interconnects was not possible. With SAM, evaluation of adhesives and sintered interconnects was also feasible, but quality depended strongly on the sample under test. TTA enabled sufficiently detailed results for all the interconnect applications. Automated TTA equipment, as the in-house developed tester used within this investigation, enabled measurement times compatible with SAM and X-ray. In the investigations, all methods revealed their pros and cons, and their selection has to depend on the sample under tests and the required analysis depth and data details. In the paper, guidelines are formulated for an appropriate decision on the NDT method depending on sample and requirements. UR - https://doi.org/10.3390/app10238516 KW - reliability KW - nondestructive testing KW - power electronics KW - X-ray KW - scanning acoustic microscopy KW - transient thermal analysis KW - TTA KW - sintering KW - LED KW - MOSFET Y1 - 2020 UR - https://doi.org/10.3390/app10238516 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-12518 SN - 2076-3417 VL - 10 IS - 23 PB - MDPI CY - Basel ER - TY - CHAP A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Signorini, Raffaella A1 - Liu, E A1 - Pedron, Danilo A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates T2 - Integrated Optics: Design, Devices, Systems and Applications VI UR - https://doi.org/10.1117/12.2576414 Y1 - 2021 UR - https://doi.org/10.1117/12.2576414 SN - 978-1-5106-4385-7 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Characterization of copper sintered interconnects by transient thermal analysis T2 - 2021 International Conference on Electronics Packaging (ICEP 2021) UR - https://doi.org/10.23919/ICEP51988.2021.9451966 KW - copper sintering KW - transient thermal analysis (TTA) KW - thermal impedance (Zth) KW - non-destructive testing (NDT) KW - scanning acoustic microscopy (SAM) Y1 - 2021 UR - https://doi.org/10.23919/ICEP51988.2021.9451966 SN - 978-4-9911-9111-4 SP - 71 EP - 72 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229843 KW - finite element method KW - gallium nitride (GaN) KW - LED KW - Raman spectroscopy KW - semiconductor KW - thermomechanical stress Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229843 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders T2 - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC48849.2020.9229801 KW - copper inks KW - sintering KW - low temperature KW - copper nano particles KW - copper formate KW - binder KW - terpineol KW - hexylamine KW - amino-2-propanol Y1 - 2020 UR - https://doi.org/10.1109/ESTC48849.2020.9229801 SN - 978-1-7281-6293-5 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon T1 - Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 KW - Creep KW - Thermomechanical processes KW - Silicon nitride KW - Copper KW - Plastics KW - Microstructure KW - Soldering Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420523 SN - 978-1-7281-7643-7 SP - 204 EP - 208 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Riedel, Andreas A1 - Elger, Gordon T1 - Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 KW - MOSFET KW - Power measurement KW - Pulse measurements KW - Current measurement KW - Multichip modules KW - Time measurement KW - Thermal analysis Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 SN - 978-1-7281-7643-7 SP - 268 EP - 273 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Advanced location resolved transient thermal analysis T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 KW - Temperature measurement KW - Semiconductor device measurement KW - Thermal resistance KW - Thermal conductivity KW - Dielectric measurement KW - Thermal analysis KW - Dielectrics Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 SN - 978-1-7281-7643-7 SP - 191 EP - 196 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Mokhtari, Omid A1 - Conti, Fosca A1 - Saccon, Rodolfo A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure JF - New Journal of Chemistry UR - https://doi.org/10.1039/D1NJ02476K Y1 - 2021 UR - https://doi.org/10.1039/D1NJ02476K SN - 1369-9261 VL - 45 IS - 43 SP - 20133 EP - 20139 PB - RSC CY - London ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Mauser, Armin A1 - Rubenbauer, Thomas A1 - Bruetting, Robert A1 - Schneider-Ramelow, Martin A1 - Elger, Gordon T1 - Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging JF - ACS Applied Electronic Materials UR - https://doi.org/10.1021/acsaelm.1c00721 KW - sintering KW - brass flakes KW - nanostructured materials KW - self-reducing KW - etching KW - surface modifications Y1 - 2021 UR - https://doi.org/10.1021/acsaelm.1c00721 SN - 2637-6113 VL - 3 IS - 10 SP - 4587 EP - 4603 PB - ACS Publications CY - Washington ER - TY - JOUR A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Elger, Gordon T1 - A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition JF - IEEE Transactions on Instrumentation and Measurement UR - https://doi.org/10.1109/TIM.2020.3011818 KW - LED KW - linear time-invariant (LTI) system KW - MOSFET KW - noise suppression KW - reliability KW - semiconductor KW - signal processing KW - thermal impedance (Zth) KW - transient thermal analysis (TTA) Y1 - 2021 UR - https://doi.org/10.1109/TIM.2020.3011818 SN - 0018-9456 VL - 70 PB - IEEE CY - New York ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Conti, Fosca A1 - Elger, Gordon T1 - Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol JF - Scripta Materialia UR - https://doi.org/10.1016/j.scriptamat.2020.02.045 Y1 - 2020 UR - https://doi.org/10.1016/j.scriptamat.2020.02.045 SN - 1359-6462 VL - 2020 IS - 182 SP - 74 EP - 80 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging JF - Journal of Alloys and Compounds UR - https://doi.org/10.1016/j.jallcom.2020.156043 KW - Metals and alloys KW - Microstructure KW - Surfaces and interfaces KW - Sintering Y1 - 2020 UR - https://doi.org/10.1016/j.jallcom.2020.156043 SN - 1873-4669 VL - 2020 IS - 844 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Mokhtari, Omid A1 - Conti, Fosca A1 - Bhogaraju, Sri Krishna A1 - Meier, Markus A1 - Schweigart, Helmut A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor JF - New Journal of Chemistry UR - https://doi.org/10.1039/C9NJ02135C Y1 - 2019 UR - https://doi.org/10.1039/C9NJ02135C SN - 1369-9261 VL - 43 IS - 26 SP - 10227 EP - 10231 PB - RSC CY - London ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Schmid, Maximilian A1 - Meier, Markus A1 - Schweigart, Helmut A1 - Elger, Gordon T1 - Development of sinter paste with surface modified copper alloy particles for die-attach bonding T2 - ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems Y1 - 2020 UR - https://www.vde-verlag.de/proceedings-de/455225100.html SN - 978-3-8007-5226-3 SN - 978-3-8007-5225-6 N1 - Auch veröffentlicht auf IEEE: https://ieeexplore.ieee.org/document/9097746 SP - 582 EP - 587 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Elger, Gordon A1 - Liu, E A1 - Conti, Fosca A1 - Signorini, Raffaella A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna T1 - Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724533 KW - Conferences KW - Microelectronics KW - Micromechanical devices Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724533 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization T2 - International Symposium on Microelectronics UR - https://doi.org/10.4071/2380-4505-2019.1.000387 Y1 - 2019 UR - https://doi.org/10.4071/2380-4505-2019.1.000387 SN - 2380-4505 SN - 1085-8024 VL - 2019 IS - 1 SP - 387 EP - 392 PB - IMAPS CY - Pittsburgh ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Conti, Fosca A1 - Elger, Gordon T1 - Improved sinterability of particles to substrates by surface modifications on substrate metallization T2 - Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 Y1 - 2019 UR - https://doi.org/10.4071/2380-4491.2019.HiTen.000066 SN - 2380-4491 VL - 2019 IS - HiTen SP - 66 EP - 70 PB - IMAPS CY - Pittsburgh (PA) ER - TY - CHAP A1 - Signorini, Raffaella A1 - Conti, Fosca A1 - Brugnolotto, Enrico A1 - Pedron, Danilo A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon ED - Cheben, Pavel ED - Čtyroký, Jiří ED - Molina-Fernández, Iñigo T1 - Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy T2 - Integrated Optics: Design, Devices, Systems, and Applications V UR - https://doi.org/10.1117/12.2520992 Y1 - 2019 UR - https://doi.org/10.1117/12.2520992 SN - 978-1-5106-2729-1 N1 - Presentation + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923548 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923548 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Brugnolotto, Enrico A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Conti, Fosca A1 - Pedron, Danilo A1 - Signorini, Raffaella A1 - Elger, Gordon T1 - Investigation of thermomechanical local stress induced in assembled GaN LEDs T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923629 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923629 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level T2 - 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC.2019.00320 KW - reliability KW - thermal KW - silver sintering KW - MOSFET KW - measurment equipment Y1 - 2019 UR - https://doi.org/10.1109/ECTC.2019.00320 SN - 978-1-7281-1499-6 SP - 2324 EP - 2330 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Reliability of SAC Solders under Low and High Stress Conditions T2 - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC55720.2022.9939394 KW - reliability KW - solder joint cracking KW - SAC solder KW - transient thermal analysis KW - SAM Y1 - 2022 UR - https://doi.org/10.1109/ESTC55720.2022.9939394 SN - 978-1-6654-8947-8 SP - 553 EP - 559 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon A1 - Mou, Rokeya Mumtahana T1 - Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS) T2 - Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 KW - component KW - μ-Raman Spectroscopy KW - Au80Sn20 KW - Cu sintering KW - finite element simultion Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00123 SN - 978-1-6654-7943-1 SP - 739 EP - 745 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Saccon, Rodolfo A1 - Benin, Alice A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Effect of binders on the performance of copper sintering pastes T2 - 2022 International Conference on Electronics Packaging (ICEP 2022) UR - https://doi.org/10.23919/ICEP55381.2022.9795555 KW - copper sintering KW - binders KW - nanoparticles KW - reduction KW - alcohols, polyols Y1 - 2022 UR - https://doi.org/10.23919/ICEP55381.2022.9795555 SN - 978-4-9911911-3-8 SP - 71 EP - 72 PB - IEEE CY - Piscataway (NJ) ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Reliability of sintered and soldered high power chip size packages and flip chip LEDs T2 - ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings UR - https://doi.org/10.1109/ECTC.2018.00312 Y1 - 2018 UR - https://doi.org/10.1109/ECTC.2018.00312 SN - 978-1-5386-5000-4 SP - 2080 EP - 2088 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Conti, Fosca A1 - Elger, Gordon T1 - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging T2 - Proceedings 22nd European Microelectronics and Packaging Conference, EMPC UR - https://doi.org/10.23919/EMPC44848.2019.8951887 Y1 - 2020 UR - https://doi.org/10.23919/EMPC44848.2019.8951887 SN - 978-1-7281-6291-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Process development and reliability of sintered high power chip size packages and flip chip LEDs T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) UR - https://doi.org/10.23919/ICEP.2018.8374351 KW - LED KW - Reliability KW - Sintering KW - Transient Thermal Testing Y1 - 2018 UR - https://doi.org/10.23919/ICEP.2018.8374351 SN - 978-4-9902-1885-0 SP - 479 EP - 484 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon A1 - Conti, Fosca T1 - Evaluation of silver and copper sintering of first level interconnects for high power LEDs T2 - 2018 7th Electronic System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC.2018.8546499 KW - transient thermal analysis KW - pressureless silver sintering KW - pressureless copper sintering KW - bonding atmosphere KW - particle size KW - binder chemistry Y1 - 2018 UR - https://doi.org/10.1109/ESTC.2018.8546499 SN - 978-1-5386-6814-6 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Mokhtari, Omid A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor JF - New Journal of Chemistry UR - https://doi.org/10.1039/C8NJ04173C Y1 - 2018 UR - https://doi.org/10.1039/C8NJ04173C SN - 1369-9261 VL - 42 IS - 23 SP - 19232 EP - 19236 PB - RSC CY - London ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Liu, E A1 - Saccon, Rodolfo A1 - Elger, Gordon A1 - Klassen, Holger A1 - Müller, Klaus A1 - Pirzer, Georg T1 - Low cost copper based sintered interconnect material for optoelectronics packaging T2 - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC51906.2022.00270 KW - Cu sintering KW - flakes KW - PEG600 KW - reliability KW - encapsulation KW - oxidation KW - transient thermal analysis KW - Scanning acoustic microscopy KW - μ-Raman spectroscopy Y1 - 2022 UR - https://doi.org/10.1109/ECTC51906.2022.00270 SN - 978-1-6654-7943-1 SP - 1720 EP - 1725 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Signorini, Raffaella A1 - Pedron, Danilo A1 - Conti, Fosca A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593304 KW - Stress KW - Light emitting diodes KW - Gallium nitride KW - Phonons KW - Substrates KW - Temperature measurement KW - Silicon Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593304 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Liu, E A1 - Bhogaraju, Sri Krishna A1 - Wunderle, Bernhard A1 - Elger, Gordon T1 - Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2022.114664 Y1 - 2022 UR - https://doi.org/10.1016/j.microrel.2022.114664 SN - 0026-2714 VL - 2022 IS - 138 PB - Elsevier CY - Amsterdam ER - TY - CHAP A1 - Mohan, Nihesh A1 - Bhogaraju, Sri Krishna A1 - Lysien, Mateusz A1 - Schneider, Ludovic A1 - Granek, Filip A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Drop feature optimization for fine trace inkjet printing T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9585004 KW - inkjet printing KW - Ag nanoparticles KW - fine trace KW - surface interactions KW - drop feature KW - ink properties KW - sintering Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9585004 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Elger, Gordon T1 - Highly reliable die-attach bonding with etched brass flakes T2 - 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers UR - https://doi.org/10.23919/EMPC53418.2021.9584967 KW - sintering KW - etched brass KW - flakes KW - reliability KW - LED KW - die-attach KW - in-situ copper oxide reduction KW - transient thermal analysis Y1 - 2021 UR - https://doi.org/10.23919/EMPC53418.2021.9584967 SN - 978-0-9568086-7-7 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Steinberger, Fabian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques T2 - NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers UR - https://doi.org/10.23919/NordPac58023.2023.10186250 KW - profilometry KW - sinter paste KW - interconnect KW - SAM Y1 - 2023 UR - https://doi.org/10.23919/NordPac58023.2023.10186250 SN - 978-91-89821-06-4 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Webler, Ralf A1 - Kotadia, Hiren R. A1 - Erdogan, Hüseyin A1 - Elger, Gordon T1 - Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks JF - New Journal of Chemistry UR - https://doi.org/10.1039/D3NJ05185D Y1 - 2024 UR - https://doi.org/10.1039/D3NJ05185D SN - 1369-9261 VL - 48 IS - 15 SP - 6796 EP - 6808 PB - RSC CY - London ER - TY - CHAP A1 - Mohan, Nihesh A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418323 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418323 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Ugolini, Francesco A1 - Belponer, Federico A1 - Greci, Alessio A1 - Elger, Gordon T1 - Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418348 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418348 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mohan, Nihesh A1 - Steinberger, Fabian A1 - Erdogan, Hüseyin A1 - Hadrava, Philipp A1 - Elger, Gordon T1 - Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418277 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418277 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Ahuir-Torres, Juan Ignacio A1 - Bhogaraju, Sri Krishna A1 - West, Geoff A1 - Elger, Gordon A1 - Kotadia, Hiren R. T1 - Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application T2 - 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) UR - https://doi.org/10.23919/EMPC55870.2023.10418365 Y1 - 2024 UR - https://doi.org/10.23919/EMPC55870.2023.10418365 SN - 978-0-9568086-9-1 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Elger, Gordon A1 - Bhogaraju, Sri Krishna A1 - Schneider-Ramelow, Martin T1 - Hybrid Cu sinter paste for low temperature bonding of bare semiconductors JF - Materials Letters N2 - A novel hybrid copper paste was developed for low temperature sintering of bare semiconductors. Cu(II) formate (Cu(for)) is complexed in amino-2-propanol (A2P) and added to a paste of etched brass micro flakes. A two-step sintering process is applied: The paste is printed and dried at 120 °C under formic acid (FA) enriched N2 atmosphere (FAN2) for 5 min. Afterwards, bare semiconductors are placed and sintered at 250 °C for 5 min applying a bonding pressure of 20 MPa/10 MPa. By the thermal decomposition of the Cu(for) atomic Cu is released and forms in-situ Cu-nanoparticles. An interconnect is realized with shear strength >100 MPa. UR - https://doi.org/10.1016/j.matlet.2024.136973 Y1 - 2024 UR - https://doi.org/10.1016/j.matlet.2024.136973 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-49138 SN - 1873-4979 VL - 2024 IS - 372 PB - Elsevier CY - New York ER - TY - CHAP A1 - Paret, Paul A1 - Bhogaraju, Sri Krishna A1 - Busse, Dirk A1 - Dahlbüdding, Alexander A1 - Elger, Gordon A1 - Narumanchi, Sreekant T1 - Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock T2 - Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 Y1 - 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 SN - 979-8-3503-7598-5 SP - 1219 EP - 1224 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Conti, Fosca A1 - Lux, Kerstin A1 - Bhogaraju, Sri Krishna A1 - Liu, E A1 - Lenz, Christoph A1 - Seitz, Roland A1 - Elger, Gordon ED - Baldini, Francesco ED - Homola, Jiri ED - Lieberman, Robert A. T1 - Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates T2 - Optical Sensors 2021 UR - https://doi.org/10.1117/12.2591947 Y1 - 2021 UR - https://doi.org/10.1117/12.2591947 SN - 978-1-5106-4379-6 N1 - Poster + Paper PB - SPIE CY - Bellingham ER - TY - CHAP A1 - Pandey, Amit A1 - Bhogaraju, Sri Krishna A1 - Lux, Kerstin A1 - Elger, Gordon T1 - Analysis of stress in spherically bent thinned image sensors T2 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE54907.2022.9758847 KW - image sensors KW - semiconductor device measurement KW - spectroscopy KW - compressive stress KW - bending KW - silicon KW - bonding Y1 - 2022 UR - https://doi.org/10.1109/EuroSimE54907.2022.9758847 SN - 978-1-6654-5836-8 PB - IEEE CY - Piscataway, NJ ER -