TY - CHAP A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content T2 - Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020 UR - https://doi.org/10.1109/ECTC32862.2020.00312 KW - Composites KW - Soldering KW - Porosity KW - Microstructure KW - Intermetallics KW - Phase interfaces Y1 - 2020 UR - https://doi.org/10.1109/ECTC32862.2020.00312 SN - 978-1-7281-6180-8 SN - 2377-5726 SP - 2005 EP - 2012 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Keim, Simon A1 - Tetzlaff, Ulrich A1 - Elger, Gordon T1 - Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging JF - Journal of Alloys and Compounds UR - https://doi.org/10.1016/j.jallcom.2020.156043 KW - Metals and alloys KW - Microstructure KW - Surfaces and interfaces KW - Sintering Y1 - 2020 UR - https://doi.org/10.1016/j.jallcom.2020.156043 SN - 1873-4669 VL - 2020 IS - 844 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Ernst, Benedikt A1 - Keim, Simon A1 - Tetzlaff, Ulrich T1 - On the anisotropic indentation modulus and anisotropic creep behavior of β-Sn characterized by nanoindentation methods JF - Materials Science and Engineering: A UR - https://doi.org/10.1016/j.msea.2022.143392 Y1 - 2022 UR - https://doi.org/10.1016/j.msea.2022.143392 SN - 1873-4936 SN - 0921-5093 VL - 2022 IS - 848 PB - Elsevier CY - Amsterdam ER -