TY - JOUR A1 - Thambi, Joel Luther A1 - Schiessl, Andreas A1 - Waltz, Manuela A1 - Lang, Klaus-Dieter A1 - Tetzlaff, Ulrich T1 - Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys JF - Journal of Electronic Packaging UR - https://doi.org/10.1115/1.4035850 KW - failure analysis KW - harsh environment KW - microsystems KW - physics of failure KW - reliability KW - SMT KW - solder KW - thermal analysis Y1 - 2017 UR - https://doi.org/10.1115/1.4035850 SN - 1528-9044 SN - 1043-7398 VL - 139 IS - 3 PB - The American Society of Mechanical Engineers CY - New York ER - TY - JOUR A1 - Thambi, Joel Luther A1 - Tetzlaff, Ulrich A1 - Schiessl, Andreas A1 - Lang, Klaus-Dieter A1 - Waltz, Manuela T1 - High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2016.10.004 KW - Sn3.8Ag0.7Cu (SAC) KW - high cycle fatigue KW - local stress KW - FKM guideline KW - cyclic softening KW - stress concentration KW - roughness KW - mean stress KW - solder joint KW - surface mount technology (SMT) KW - stress KW - experimental analysis KW - vibration Y1 - 2016 UR - https://doi.org/10.1016/j.microrel.2016.10.004 SN - 0026-2714 IS - 66 SP - 98 EP - 105 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Thambi, Joel Luther A1 - Tetzlaff, Ulrich A1 - Schiessl, Andreas A1 - Lang, Klaus-Dieter A1 - Waltz, Manuela T1 - Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2019.113560 KW - SnAgCu KW - High cycle fatigue (HCF) KW - Local stress KW - FKM guideline KW - Stress gradient KW - Roughness KW - Solder alloys KW - Experimental analysis KW - FEA KW - Surface mount technology (SMT) KW - Vibration KW - Harmonic frequency KW - Bulk solder KW - Fatigue KW - Durability KW - Solder joint failure KW - Component testing KW - Material characterisation KW - Chip capacitor KW - Transformer Y1 - 2020 UR - https://doi.org/10.1016/j.microrel.2019.113560 SN - 0026-2714 VL - 2020 IS - 106 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Ernst, Benedikt A1 - Kubaschinski, Paul A1 - Schiessl, Andreas A1 - Waltz, Manuela A1 - Höppel, Heinz Werner A1 - Tetzlaff, Ulrich T1 - Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and 𝛽-Sn single crystal calculations JF - Materials Science and Engineering: A N2 - Sn-based solders are known for their tendency to form coarse grained microstructures. In combination with the high elastic anisotropy of 𝛽-Sn, the overall elastic properties and their interpretation require a careful discussion of the structure–property-relationship as elastic constants are often important input parameters for creep or fatigue models. This study therefore investigates the influence of microstructure and testing method on the Young’s modulus E for the widespread lead free solder alloy Sn-Ag3.8-Cu0.7 (SAC387) using bulk specimens. Due to its already high homologous temperature at room temperature (Thom ≈ 0.6 = T/Tm for Tm being the melting temperature), hot tensile tests generally bear the risk of superimposed creep deformation. Mechanical testing becomes even more challenging, since yield strengths are usually low for these alloys. Consequently, in addition to the hot tensile tests executed for the engineering strain rate 𝜖̇𝑒 = 1 ⋅ 10−3 s−1, two supplemental methods are used to determine the Young’s modulus comprising of the dynamic resonance frequency measurement and the calculation of the Young’s modulus based on single crystal compliance data of the majority phase 𝛽-Sn.Young’s moduli yielded from dynamic resonance frequency measurement and calculations based on single crystal compliance data showed comparable results of (E35 ◦C ≈ 55 GPa, E80 ◦C ≈ 51 GPa and E125 ◦C ≈ 48 GPa). Hot tensile tests showed similar data with the largest deviation at 80 ◦C, where E80 ◦C ≈ 53 GPa was determined. These absolute values and their temperature dependence can be attributed to the microstructure of the cast specimens which show a general preferred orientation of 𝛽-Sn grains close to <110> after analysis via electron backscattered diffraction (EBSD). A comparison with literature data revealed significant differences in the Young’s moduli which are likely to be attributed to differences in the preferred orientation of 𝛽-Sn grains. UR - https://doi.org/10.1016/j.msea.2024.147354 Y1 - 2024 UR - https://doi.org/10.1016/j.msea.2024.147354 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-52143 SN - 1873-4936 SN - 0921-5093 VL - 2024 IS - 916 PB - Elsevier CY - Amsterdam ER -