TY - JOUR A1 - Thambi, Joel Luther A1 - Tetzlaff, Ulrich A1 - Schiessl, Andreas A1 - Lang, Klaus-Dieter A1 - Waltz, Manuela T1 - High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2016.10.004 KW - Sn3.8Ag0.7Cu (SAC) KW - high cycle fatigue KW - local stress KW - FKM guideline KW - cyclic softening KW - stress concentration KW - roughness KW - mean stress KW - solder joint KW - surface mount technology (SMT) KW - stress KW - experimental analysis KW - vibration Y1 - 2016 UR - https://doi.org/10.1016/j.microrel.2016.10.004 SN - 0026-2714 IS - 66 SP - 98 EP - 105 PB - Elsevier CY - Amsterdam ER - TY - JOUR A1 - Thambi, Joel Luther A1 - Schiessl, Andreas A1 - Waltz, Manuela A1 - Lang, Klaus-Dieter A1 - Tetzlaff, Ulrich T1 - Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys JF - Journal of Electronic Packaging UR - https://doi.org/10.1115/1.4035850 KW - failure analysis KW - harsh environment KW - microsystems KW - physics of failure KW - reliability KW - SMT KW - solder KW - thermal analysis Y1 - 2017 UR - https://doi.org/10.1115/1.4035850 SN - 1528-9044 SN - 1043-7398 VL - 139 IS - 3 PB - The American Society of Mechanical Engineers CY - New York ER - TY - JOUR A1 - Thambi, Joel Luther A1 - Tetzlaff, Ulrich A1 - Schiessl, Andreas A1 - Lang, Klaus-Dieter A1 - Waltz, Manuela T1 - Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach JF - Microelectronics Reliability UR - https://doi.org/10.1016/j.microrel.2019.113560 KW - SnAgCu KW - High cycle fatigue (HCF) KW - Local stress KW - FKM guideline KW - Stress gradient KW - Roughness KW - Solder alloys KW - Experimental analysis KW - FEA KW - Surface mount technology (SMT) KW - Vibration KW - Harmonic frequency KW - Bulk solder KW - Fatigue KW - Durability KW - Solder joint failure KW - Component testing KW - Material characterisation KW - Chip capacitor KW - Transformer Y1 - 2020 UR - https://doi.org/10.1016/j.microrel.2019.113560 SN - 0026-2714 VL - 2020 IS - 106 PB - Elsevier CY - Amsterdam ER -