TY - CHAP A1 - Paret, Paul A1 - Bhogaraju, Sri Krishna A1 - Busse, Dirk A1 - Dahlbüdding, Alexander A1 - Elger, Gordon A1 - Narumanchi, Sreekant T1 - Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock T2 - Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 Y1 - 2024 UR - https://doi.org/10.1109/ECTC51529.2024.00196 SN - 979-8-3503-7598-5 SP - 1219 EP - 1224 PB - IEEE CY - Piscataway ER -