TY - CHAP A1 - Hanss, Alexander A1 - Liu, E A1 - Abdullah, Muhammad Rizwan A1 - Elger, Gordon T1 - Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models T2 - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE.2019.8724558 KW - Conferences KW - Microelectronics KW - Micromechanical devices KW - Light emitting diodes KW - Aluminum nitride KW - III-V semiconductor materials Y1 - 2019 UR - https://doi.org/10.1109/EuroSimE.2019.8724558 SN - 978-1-5386-8040-7 PB - IEEE CY - Piscataway ER -