TY - CHAP A1 - Stenzel, Gerhard A1 - Schmid, Kyrill A1 - Kölle, Michael A1 - Altmann, Philipp A1 - Lingsch-Rosenfeld, Marian A1 - Zorn, Maximilian A1 - Bücher, Tim A1 - Gabor, Thomas A1 - Wirsing, Martin A1 - Belzner, Lenz ED - Steffen, Bernhard T1 - SEGym: Optimizing Large Language Model Assisted Software Engineering Agents with Reinforcement Learning T2 - Bridging the Gap Between AI and Reality, Second International Conference, AISoLA 2024, Crete, Greece, October 30 – November 3, 2024, Proceedings UR - https://doi.org/10.1007/978-3-031-75434-0_8 Y1 - 2024 UR - https://doi.org/10.1007/978-3-031-75434-0_8 SN - 978-3-031-75434-0 SP - 107 EP - 124 PB - Springer CY - Cham ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Schmid, Maximilian A1 - Hufnagel, Elias A1 - Conti, Fosca A1 - Kotadia, Hiren R. A1 - Elger, Gordon T1 - Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste T2 - IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings UR - https://doi.org/10.1109/ECTC32696.2021.00094 KW - low temperature sintering KW - rapid sintering KW - Cu(II) formate KW - reducing binder KW - low pressure sintering KW - high bond strength Y1 - 2021 UR - https://doi.org/10.1109/ECTC32696.2021.00094 SN - 978-1-6654-4097-4 SP - 526 EP - 531 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Characterization of copper sintered interconnects by transient thermal analysis T2 - 2021 International Conference on Electronics Packaging (ICEP 2021) UR - https://doi.org/10.23919/ICEP51988.2021.9451966 KW - copper sintering KW - transient thermal analysis (TTA) KW - thermal impedance (Zth) KW - non-destructive testing (NDT) KW - scanning acoustic microscopy (SAM) Y1 - 2021 UR - https://doi.org/10.23919/ICEP51988.2021.9451966 SN - 978-4-9911-9111-4 SP - 71 EP - 72 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Riedel, Andreas A1 - Elger, Gordon T1 - Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 KW - MOSFET KW - Power measurement KW - Pulse measurements KW - Current measurement KW - Multichip modules KW - Time measurement KW - Thermal analysis Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420493 SN - 978-1-7281-7643-7 SP - 268 EP - 273 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Liu, E A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Advanced location resolved transient thermal analysis T2 - 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 KW - Temperature measurement KW - Semiconductor device measurement KW - Thermal resistance KW - Thermal conductivity KW - Dielectric measurement KW - Thermal analysis KW - Dielectrics Y1 - 2021 UR - https://doi.org/10.1109/THERMINIC49743.2020.9420538 SN - 978-1-7281-7643-7 SP - 191 EP - 196 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Elger, Gordon T1 - A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition JF - IEEE Transactions on Instrumentation and Measurement UR - https://doi.org/10.1109/TIM.2020.3011818 KW - LED KW - linear time-invariant (LTI) system KW - MOSFET KW - noise suppression KW - reliability KW - semiconductor KW - signal processing KW - thermal impedance (Zth) KW - transient thermal analysis (TTA) Y1 - 2021 UR - https://doi.org/10.1109/TIM.2020.3011818 SN - 0018-9456 VL - 70 PB - IEEE CY - New York ER - TY - CHAP A1 - Zippelius, Andreas A1 - Hanss, Alexander A1 - Liu, E A1 - Schmid, Maximilian A1 - Pérez-Velázquez, Judith A1 - Elger, Gordon T1 - Comparing prediction methods for LED failure measured with Transient Thermal Analysis T2 - 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) UR - https://doi.org/10.1109/EuroSimE48426.2020.9152657 KW - Temperature measurement KW - Artificial neural networks KW - Light emitting diodes KW - Aging KW - Current measurement KW - Training KW - Heating systems Y1 - 2020 UR - https://doi.org/10.1109/EuroSimE48426.2020.9152657 SN - 978-1-7281-6049-8 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Schmid, Maximilian A1 - Meier, Markus A1 - Schweigart, Helmut A1 - Elger, Gordon T1 - Development of sinter paste with surface modified copper alloy particles for die-attach bonding T2 - ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems Y1 - 2020 UR - https://www.vde-verlag.de/proceedings-de/455225100.html SN - 978-3-8007-5226-3 SN - 978-3-8007-5225-6 N1 - Auch veröffentlicht auf IEEE: https://ieeexplore.ieee.org/document/9097746 SP - 582 EP - 587 PB - VDE Verlag CY - Berlin ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hanss, Alexander A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition T2 - 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2019.8923548 Y1 - 2019 UR - https://doi.org/10.1109/THERMINIC.2019.8923548 SN - 978-1-7281-2078-2 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level T2 - 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) UR - https://doi.org/10.1109/ECTC.2019.00320 KW - reliability KW - thermal KW - silver sintering KW - MOSFET KW - measurment equipment Y1 - 2019 UR - https://doi.org/10.1109/ECTC.2019.00320 SN - 978-1-7281-1499-6 SP - 2324 EP - 2330 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Liu, E A1 - Elger, Gordon T1 - Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints T2 - Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022 UR - https://doi.org/10.1109/iTherm54085.2022.9899664 KW - reliability KW - transient thermal analysis (TTA) KW - scanning acoustic microscopy (SAM) KW - finite element simulation KW - finite element optimization KW - LED KW - solder KW - crack Y1 - 2022 UR - https://doi.org/10.1109/iTherm54085.2022.9899664 SN - 978-1-6654-8503-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Zippelius, Andreas A1 - Strobl, Tobias A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Hoffmann, Alwin A1 - Elger, Gordon T1 - Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks T2 - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC55720.2022.9939465 KW - Solder Joints KW - LED KW - non-destructive testing KW - Machine Learning KW - Scanning Acoustic Microscopy (SAM) KW - Transient Thermal Analysis (TTA), Convolutional Neural Network (CNN) Y1 - 2022 UR - https://doi.org/10.1109/ESTC55720.2022.9939465 SN - 978-1-6654-8947-8 SP - 566 EP - 575 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Hermann, Joseph A1 - Bhogaraju, Sri Krishna A1 - Elger, Gordon T1 - Reliability of SAC Solders under Low and High Stress Conditions T2 - 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC55720.2022.9939394 KW - reliability KW - solder joint cracking KW - SAC solder KW - transient thermal analysis KW - SAM Y1 - 2022 UR - https://doi.org/10.1109/ESTC55720.2022.9939394 SN - 978-1-6654-8947-8 SP - 553 EP - 559 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Reliability of sintered and soldered high power chip size packages and flip chip LEDs T2 - ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings UR - https://doi.org/10.1109/ECTC.2018.00312 Y1 - 2018 UR - https://doi.org/10.1109/ECTC.2018.00312 SN - 978-1-5386-5000-4 SP - 2080 EP - 2088 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Mokhtari, Omid A1 - Pascucci, Jacopo A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Conti, Fosca A1 - Elger, Gordon T1 - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging T2 - Proceedings 22nd European Microelectronics and Packaging Conference, EMPC UR - https://doi.org/10.23919/EMPC44848.2019.8951887 Y1 - 2020 UR - https://doi.org/10.23919/EMPC44848.2019.8951887 SN - 978-1-7281-6291-1 PB - IEEE CY - Piscataway ER - TY - JOUR A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Liu, E A1 - Elger, Gordon T1 - Transient thermal analysis as measurement method for IC package structural integrity JF - Chinese Physics B UR - https://doi.org/10.1088/1674-1056/24/6/068105 Y1 - 2015 UR - https://doi.org/10.1088/1674-1056/24/6/068105 SN - 2058-3834 SN - 1674-1056 VL - 24 IS - 6 PB - IOP Publishing CY - Bristol ER - TY - CHAP A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Bhogaraju, Sri Krishna A1 - Conti, Fosca A1 - Elger, Gordon T1 - Process development and reliability of sintered high power chip size packages and flip chip LEDs T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) UR - https://doi.org/10.23919/ICEP.2018.8374351 KW - LED KW - Reliability KW - Sintering KW - Transient Thermal Testing Y1 - 2018 UR - https://doi.org/10.23919/ICEP.2018.8374351 SN - 978-4-9902-1885-0 SP - 479 EP - 484 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Bhogaraju, Sri Krishna A1 - Hanss, Alexander A1 - Schmid, Maximilian A1 - Elger, Gordon A1 - Conti, Fosca T1 - Evaluation of silver and copper sintering of first level interconnects for high power LEDs T2 - 2018 7th Electronic System-Integration Technology Conference (ESTC) UR - https://doi.org/10.1109/ESTC.2018.8546499 KW - transient thermal analysis KW - pressureless silver sintering KW - pressureless copper sintering KW - bonding atmosphere KW - particle size KW - binder chemistry Y1 - 2018 UR - https://doi.org/10.1109/ESTC.2018.8546499 SN - 978-1-5386-6814-6 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Schmid, Maximilian A1 - Elger, Gordon T1 - Measurement of the transient thermal impedance of MOSFETs over the sensitivity of the threshold voltage T2 - EPE'18 ECCE Europe KW - Reliability KW - MOSFET KW - Thermal stress KW - Thermal design KW - Measurement Y1 - 2018 UR - https://ieeexplore.ieee.org/document/8515480 SN - 978-9-0758-1528-3 PB - IEEE CY - Piscataway ER - TY - CHAP A1 - Elger, Gordon A1 - Hanss, Alexander A1 - Schmid, Maximilian T1 - Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs T2 - 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) UR - https://doi.org/10.1109/THERMINIC.2018.8593278 KW - Temperature measurement KW - Conferences KW - Integrated circuits KW - Light emitting diodes KW - Transient analysis KW - Temperature dependence KW - Thermal analysis Y1 - 2018 UR - https://doi.org/10.1109/THERMINIC.2018.8593278 SN - 978-1-5386-6759-0 PB - IEEE CY - Piscataway ER -