TY - JOUR A1 - Bhogaraju, Sri Krishna A1 - Kotadia, Hiren R. A1 - Conti, Fosca A1 - Mauser, Armin A1 - Rubenbauer, Thomas A1 - Bruetting, Robert A1 - Schneider-Ramelow, Martin A1 - Elger, Gordon T1 - Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging JF - ACS Applied Electronic Materials UR - https://doi.org/10.1021/acsaelm.1c00721 KW - sintering KW - brass flakes KW - nanostructured materials KW - self-reducing KW - etching KW - surface modifications Y1 - 2021 UR - https://doi.org/10.1021/acsaelm.1c00721 SN - 2637-6113 VL - 3 IS - 10 SP - 4587 EP - 4603 PB - ACS Publications CY - Washington ER - TY - JOUR A1 - Elger, Gordon A1 - Bhogaraju, Sri Krishna A1 - Schneider-Ramelow, Martin T1 - Hybrid Cu sinter paste for low temperature bonding of bare semiconductors JF - Materials Letters N2 - A novel hybrid copper paste was developed for low temperature sintering of bare semiconductors. Cu(II) formate (Cu(for)) is complexed in amino-2-propanol (A2P) and added to a paste of etched brass micro flakes. A two-step sintering process is applied: The paste is printed and dried at 120 °C under formic acid (FA) enriched N2 atmosphere (FAN2) for 5 min. Afterwards, bare semiconductors are placed and sintered at 250 °C for 5 min applying a bonding pressure of 20 MPa/10 MPa. By the thermal decomposition of the Cu(for) atomic Cu is released and forms in-situ Cu-nanoparticles. An interconnect is realized with shear strength >100 MPa. UR - https://doi.org/10.1016/j.matlet.2024.136973 Y1 - 2024 UR - https://doi.org/10.1016/j.matlet.2024.136973 UR - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:573-49138 SN - 1873-4979 VL - 2024 IS - 372 PB - Elsevier CY - New York ER -